Properties of direct aluminium bonded substrates for power semiconductor components - Lindemann, A.; Strauch, G. (2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), 2004)
Keywords: Aluminum oxide; Applied sciences; Bonding; Ceramics; Circuits; Copper; Design. Technologies. Operation analysis. Testing; Electrical engineering. Electrical power engineering; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Integrated circuits; Lead compounds; Power electronics; Power electronics, power supplies; Power semiconductor devices; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Silicon; Substrates; Testing. Reliability. Quality control; Thermal management (packaging); New product; Power circuit; Metallic bond; Thermal behavior; Mechanical properties; Electronic circuit; Thermomechanical properties; Power electronics; Review; Chip; Prototype tests; Thermal properties; Manufacturing process; Semiconductor substrate; Cooling system; Power device; Power semiconductor devices; Reliability; Ceramic materials; Heat sink; Comparative study; Gain