APA (7th ed.) Citation

Lindemann, A., & Strauch, G. (2004). Properties of direct aluminium bonded substrates for power semiconductor components. 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), 6, 4171-4177 Vol.6. https://doi.org/10.1109/PESC.2004.1354737

Chicago Style (17th ed.) Citation

Lindemann, A., and G. Strauch. "Properties of Direct Aluminium Bonded Substrates for Power Semiconductor Components." 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551) 6 (2004): 4171-4177 Vol.6. https://doi.org/10.1109/PESC.2004.1354737.

MLA (9th ed.) Citation

Lindemann, A., and G. Strauch. "Properties of Direct Aluminium Bonded Substrates for Power Semiconductor Components." 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), vol. 6, 2004, pp. 4171-4177 Vol.6, https://doi.org/10.1109/PESC.2004.1354737.