Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device after Moisture Sensitivity Level 1

Moisture sensitivity level (MSL) is used to classify the capability of surface mount device (SMD) packages against moisture penetration when exposed to environment, and it is quite important for SMD. Compared to conventional through-hole (TH) which typically use wave soldering process for board moun...

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Bibliographic Details
Published in2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) pp. 153 - 156
Main Authors Li, Zhiwen, Yip, Shu Ming, Fung, Yee Wai, Chen, Haibin
Format Conference Proceeding
LanguageEnglish
Published IEEE 07.12.2021
Subjects
Curing
Delamination
Manufacturing processes
Moisture
Process control
Temperature control
Workability
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DOI10.1109/EPTC53413.2021.9663876

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