APA (7th ed.) Citation

Li, Z., Yip, S. M., Fung, Y. W., & Chen, H. (2021, December 7). Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device after Moisture Sensitivity Level 1. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 153-156. https://doi.org/10.1109/EPTC53413.2021.9663876

Chicago Style (17th ed.) Citation

Li, Zhiwen, Shu Ming Yip, Yee Wai Fung, and Haibin Chen. "Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device After Moisture Sensitivity Level 1." 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) 7 Dec. 2021: 153-156. https://doi.org/10.1109/EPTC53413.2021.9663876.

MLA (9th ed.) Citation

Li, Zhiwen, et al. "Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device After Moisture Sensitivity Level 1." 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 7 Dec. 2021, pp. 153-156, https://doi.org/10.1109/EPTC53413.2021.9663876.