Augmented Reality Circuit Learning

• Published in: IEEE International Symposium on Circuits and Systems proceedings pp. 1 - 5
• Main Authors: Wang, Hao, Cheung, Sen-Ching S.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2021
• Subjects: Augmented reality; Breadboard; circuit learning; Pipelines; Real-time systems; Software; Solid modeling; Three-dimensional displays; vision-based circuit inspection

Building electronic circuits is one of the most common hands-on activities in learning STEM subjects. Beginning students often find it difficult to translate a circuit schematic into the construction of the physical circuit on a breadboard. In this paper, we describe an Augmented Reality circuit lea...