Effect of underfill staging time on fillet depression

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Published in27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium pp. 94 - 96
Main Authors Cheong, Y.W., Then, E., Cheong Huat Ng, Giam Seng Lee, Diaz, M., De Guia, G., Mon Leong Loke
Format Conference Proceeding
LanguageEnglish
Published Piscataway NJ IEEE 2002
Subjects
Applied sciences
Bonding
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Inspection
Integrated circuits
Materials testing
Microscopy
Packaging
Resins
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Soldering
Temperature
US Department of Energy
Integrated circuit bonding
Die
Electronic packaging
Soldered joint
Flip-chip
BGA technology
Microassembling
Visual control
Crack
Online AccessGet full text

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Author Diaz, M.
Cheong Huat Ng
Cheong, Y.W.
Mon Leong Loke
De Guia, G.
Then, E.
Giam Seng Lee
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  surname: Mon Leong Loke
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Keywords Integrated circuit bonding
Die
Electronic packaging
Soldered joint
Flip-chip
BGA technology
Microassembling
Visual control
Crack
Language English
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MeetingName IEMT 2002 : international electronics manufacturing technology symposium (San Jose CA, 17-18 July 2002)
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StartPage 94
SubjectTerms Applied sciences
Bonding
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Inspection
Integrated circuits
Materials testing
Microscopy
Packaging
Resins
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Soldering
Temperature
US Department of Energy
Title Effect of underfill staging time on fillet depression
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