Decoupled Package-On-Package thermal characterization

Thermal characterization of a package-on-package (PoP) presents a challenge due to the variation in stacking configurations. Currently available characterization methods as outlined in the JESD51 standard cannot predict die temperatures for packages with more than one die, let alone multiple stacked...

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Bibliographic Details
Published in2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium pp. 317 - 320
Main Authors Galloway, J.E., Dreiza, M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.03.2009
Subjects
Assembly
Compact thermal model
Delphi
Electronic packaging thermal management
Package-on-Package (PoP)
Predictive models
Resistors
Semiconductor device packaging
Stacking
Telephone sets
Temperature
Testing
Thermal Characterization
Thermal resistance
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Summary:Thermal characterization of a package-on-package (PoP) presents a challenge due to the variation in stacking configurations. Currently available characterization methods as outlined in the JESD51 standard cannot predict die temperatures for packages with more than one die, let alone multiple stacked packages. A model is presented to predict die temperatures for PoP by combining individual resistor networks using a Delphi network modeling approach. Data from experimental tests were used to confirm the accuracy of a finite element analysis (FEA) based conduction model for an assembled PoP under varying power combinations. Separate FEA models for top and bottom packages were used to extract resistance values for two different resistor networks. These network models were combined to predicted die temperatures with a difference less than 7% when compared to the FEA model of the PoP.
ISBN:1424436648
9781424436644
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.2009.4810782