APA (7th ed.) Citation

Chen, C., Lee, J., Lee, D., & Lin, A. (2016, October). The failure mode study of the polymer ball interconnected IC package under board level thermal mechanical stress. Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print), 424-427. https://doi.org/10.1109/IMPACT.2016.7800064

Chicago Style (17th ed.) Citation

Chen, Cheng-Chih, Jeffrey Lee, Dem Lee, and Alice Lin. "The Failure Mode Study of the Polymer Ball Interconnected IC Package Under Board Level Thermal Mechanical Stress." Proceedings of Technical Papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) Oct. 2016: 424-427. https://doi.org/10.1109/IMPACT.2016.7800064.

MLA (9th ed.) Citation

Chen, Cheng-Chih, et al. "The Failure Mode Study of the Polymer Ball Interconnected IC Package Under Board Level Thermal Mechanical Stress." Proceedings of Technical Papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print), Oct. 2016, pp. 424-427, https://doi.org/10.1109/IMPACT.2016.7800064.