Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model

• Published in: Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) pp. 320 - 326
• Main Authors: Plotog, I., Mihailescu, B., Pencea, I., Branzei, M., Svasta, P., Cucu, T., Tarcolea, M.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2011
• Subjects: Heat transfer; Heating; Soldering; Substrates; Temperature measurement

In the case of surface mount technology (SMT), the 4P Soldering Process [1, 2, 3] concept defines solder joints as result of synergistic interactions and of correlation of Pad-Paste-Pin-Process considered as Key Process Input Variables (KPIV). As consequence, the PCB can be considered as a complex e...