Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model - Plotog, I.; Mihailescu, B.; Pencea, I.; Branzei, M.; Svasta, P.; Cucu, T.; Tarcolea, M. (Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 2011)
Keywords: Heat transfer; Heating; Soldering; Substrates; Temperature measurement