APA (7th ed.) Citation

Ya-hui, M., Xiao-song, M., Peng, Z., Yang, H., Zhi, Y., & Dong-Jing, L. (2010, August). Interface toughness characterization in microelectronic packages based on four point bending test and simulation. 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 993-997. https://doi.org/10.1109/ICEPT.2010.5582629

Chicago Style (17th ed.) Citation

Ya-hui, Ma, Ma Xiao-song, Zhou Peng, Hai Yang, You Zhi, and Liu Dong-Jing. "Interface Toughness Characterization in Microelectronic Packages Based on Four Point Bending Test and Simulation." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 993-997. https://doi.org/10.1109/ICEPT.2010.5582629.

MLA (9th ed.) Citation

Ya-hui, Ma, et al. "Interface Toughness Characterization in Microelectronic Packages Based on Four Point Bending Test and Simulation." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 993-997, https://doi.org/10.1109/ICEPT.2010.5582629.