APA (7th ed.) Citation

Fan, H. B., & Yuen, M. M. F. (2010, August). Multi-scale modeling of moisture transfer in electronic packaging. 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 758-761. https://doi.org/10.1109/ICEPT.2010.5582708

Chicago Style (17th ed.) Citation

Fan, H B., and Matthew M F. Yuen. "Multi-scale Modeling of Moisture Transfer in Electronic Packaging." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 758-761. https://doi.org/10.1109/ICEPT.2010.5582708.

MLA (9th ed.) Citation

Fan, H B., and Matthew M F. Yuen. "Multi-scale Modeling of Moisture Transfer in Electronic Packaging." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 758-761, https://doi.org/10.1109/ICEPT.2010.5582708.