APA (7th ed.) Citation

Ren, Z., Liu, D., & Zeng, Z. (2010, August). Methodology of testability design of electronic components based on the boundary-scan method? 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 1088-1092. https://doi.org/10.1109/ICEPT.2010.5582729

Chicago Style (17th ed.) Citation

Ren, Zhanyong, Dandan Liu, and Zhaoyang Zeng. "Methodology of Testability Design of Electronic Components Based on the Boundary-scan Method?" 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 1088-1092. https://doi.org/10.1109/ICEPT.2010.5582729.

MLA (9th ed.) Citation

Ren, Zhanyong, et al. "Methodology of Testability Design of Electronic Components Based on the Boundary-scan Method?" 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 1088-1092, https://doi.org/10.1109/ICEPT.2010.5582729.