Experimental research of micro-channel cooler

• Published in: 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 1355 - 1358
• Main Authors: Li Zongshuo, Wang Xiaojing, Wang Dianxiao, Wang Jia
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.08.2010
• Subjects: Coolants; Heat sinks; Heat transfer; Heating; Temperature sensors
• ISBN: 9781424481408; 1424481406
• DOI: 10.1109/ICEPT.2010.5582812

With the continuously decreasing size and constantly increasing integration of IC chips, the heat flux is increasing rapidly. Many enhancements are proposed in order to increase the thermal conductivity of micro-channels including nano-fluids, special shapes, and two phase flows, etc. This paper explores a new test system to measure the heat transfer performance of micro-channel cooler. Considering the accuracy of the test, materials with lower thermal conductivity is selected to package the cooler, and a DAQ system is set up to collect the test data. It's found that in most cases laminar flow occur, and some relationships between temperature, pressure, heat flux and mass flow are obtained. And this research proceeds as foundation for the further research work.