Thin copper metal interconnections thermomigration analysis in ESD regime

The technological scaling is posing severe constraints on metal interconnections design, especially for ESD protection network routing in advanced Smart-power technologies. A detailed analysis of thin interconnections failure mechanisms under high power pulses and of the related root causes is manda...

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Bibliographic Details
Published inElectrical Overstress/Electrostatic Discharge Symposium Proceedings 2014 pp. 1 - 10
Main Authors Di Biccari, Leonardo, Cerati, Lorenzo, Pozzobon, Fiorella, Zullino, Lucia, Morin, Sonia, Pizzo, Giansalvo, Boroni, Andrea, Andreini, Antonio
Format Conference Proceeding
LanguageEnglish
Published ESD Association 01.09.2014
Subjects
Copper
Degradation
Electrostatic discharges
Failure analysis
Stress
Strips
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Summary:The technological scaling is posing severe constraints on metal interconnections design, especially for ESD protection network routing in advanced Smart-power technologies. A detailed analysis of thin interconnections failure mechanisms under high power pulses and of the related root causes is mandatory. In this paper this analysis is illustrated by use of characterizations, failure analyses and 3D TCAD physical simulations data.
ISSN:0739-5159
2164-9340