APA (7th ed.) Citation

Takyu, S., Kurosawa, T., Shimizu, N., & Harada, S. (2006). Novel wafer dicing and chip thinning technologies realizing high chip strength. 56th Electronic Components and Technology Conference 2006, 5 pp.. https://doi.org/10.1109/ECTC.2006.1645874

Chicago Style (17th ed.) Citation

Takyu, S., T. Kurosawa, N. Shimizu, and S. Harada. "Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength." 56th Electronic Components and Technology Conference 2006 2006: 5 pp.. https://doi.org/10.1109/ECTC.2006.1645874.

MLA (9th ed.) Citation

Takyu, S., et al. "Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength." 56th Electronic Components and Technology Conference 2006, 2006, p. 5 pp., https://doi.org/10.1109/ECTC.2006.1645874.