APA (7th ed.) Citation

Yang, L., Niu, R., Xie, J., Qian, B., Song, B., & Rong, Q. (2010, August). Design-for-Reliability applications in concurrent engineering practices for electronic package development from system manufacturers' perspectives. 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 1230-1241. https://doi.org/10.1109/ICEPT.2010.5582774

Chicago Style (17th ed.) Citation

Yang, Liyu, Rui Niu, Jingsong Xie, Bin Qian, Baishi Song, and Qingan Rong. "Design-for-Reliability Applications in Concurrent Engineering Practices for Electronic Package Development from System Manufacturers' Perspectives." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 1230-1241. https://doi.org/10.1109/ICEPT.2010.5582774.

MLA (9th ed.) Citation

Yang, Liyu, et al. "Design-for-Reliability Applications in Concurrent Engineering Practices for Electronic Package Development from System Manufacturers' Perspectives." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 1230-1241, https://doi.org/10.1109/ICEPT.2010.5582774.