APA (7th ed.) Citation

Yoshida, A., Taniguchi, J., Murata, K., Kada, M., Yamamoto, Y., Takagi, Y., . . . Fujita, A. (2006). A study on package stacking process for package-on-package (PoP). 56th Electronic Components and Technology Conference 2006, 6 pp.. https://doi.org/10.1109/ECTC.2006.1645753

Chicago Style (17th ed.) Citation

Yoshida, A., J. Taniguchi, K. Murata, M. Kada, Y. Yamamoto, Y. Takagi, T. Notomi, and A. Fujita. "A Study on Package Stacking Process for Package-on-package (PoP)." 56th Electronic Components and Technology Conference 2006 2006: 6 pp.. https://doi.org/10.1109/ECTC.2006.1645753.

MLA (9th ed.) Citation

Yoshida, A., et al. "A Study on Package Stacking Process for Package-on-package (PoP)." 56th Electronic Components and Technology Conference 2006, 2006, p. 6 pp., https://doi.org/10.1109/ECTC.2006.1645753.