An embedded device technology based on a molded reconfigured wafer - Brunnbauer, M.; Furgut, E.; Beer, G.; Meyer, T.; Hedler, H.; Belonio, J.; Nomura, E.; Kiuchi, K.; Kobayashi, K. (56th Electronic Components and Technology Conference 2006, 2006)
Keywords: Assembly; Chemical technology; Costs; Electronic packaging thermal management; Laminates; Semiconductor device packaging; Silicon; Space technology; Testing; Wafer scale integration