Gielen, P., Sillen, R., & Puik, E. (2012, September). Low cost environmentally friendly ultrasonic embossed electronic circuit board. 2012 4th Electronic System-Integration Technology Conference, 1-7. https://doi.org/10.1109/ESTC.2012.6542058
Chicago Style (17th ed.) CitationGielen, Paul, Rob Sillen, and Erik Puik. "Low Cost Environmentally Friendly Ultrasonic Embossed Electronic Circuit Board." 2012 4th Electronic System-Integration Technology Conference Sep. 2012: 1-7. https://doi.org/10.1109/ESTC.2012.6542058.
MLA (9th ed.) CitationGielen, Paul, et al. "Low Cost Environmentally Friendly Ultrasonic Embossed Electronic Circuit Board." 2012 4th Electronic System-Integration Technology Conference, Sep. 2012, pp. 1-7, https://doi.org/10.1109/ESTC.2012.6542058.
Warning: These citations may not always be 100% accurate.