APA (7th ed.) Citation

Vandevelde, B., & Willems, G. (2012, September). Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds. 2012 4th Electronic System-Integration Technology Conference, 1-4. https://doi.org/10.1109/ESTC.2012.6542110

Chicago Style (17th ed.) Citation

Vandevelde, Bart, and Geert Willems. "Early Fatigue Failures in Copper Wire Bonds Inside Packages with Low CTE Green Mold Compounds." 2012 4th Electronic System-Integration Technology Conference Sep. 2012: 1-4. https://doi.org/10.1109/ESTC.2012.6542110.

MLA (9th ed.) Citation

Vandevelde, Bart, and Geert Willems. "Early Fatigue Failures in Copper Wire Bonds Inside Packages with Low CTE Green Mold Compounds." 2012 4th Electronic System-Integration Technology Conference, Sep. 2012, pp. 1-4, https://doi.org/10.1109/ESTC.2012.6542110.