Study on properties of low-Ag content Sn-Ag-Zn lead-free solders

Sn-Ag solder has been regarded as the most promising solder which can in place of Sn-Pb solder in the future, but there are reliability and cost problems limit its use. Therefore low-Ag content Sn-Ag-Cu solder, SAC105 was researched, it also has some problems. On the other hand, Sn-Ag-Zn solder has...

Full description

Saved in:
Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 399 - 404
Main Authors Tingbi Luo, Xi Chen, Jing Hu, Anmin Hu, Ming Li
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Online AccessGet full text
ISBN9781424481408
1424481406
DOI10.1109/ICEPT.2010.5582391

Cover

Abstract Sn-Ag solder has been regarded as the most promising solder which can in place of Sn-Pb solder in the future, but there are reliability and cost problems limit its use. Therefore low-Ag content Sn-Ag-Cu solder, SAC105 was researched, it also has some problems. On the other hand, Sn-Ag-Zn solder has some advantages comparing with Sn-Ag-Cu solder, but the low-Ag Content Sn-Ag-Zn solder isn't reported yet. In this paper, melt and tensile properties of Sn-xAg-1Zn (x=1, 2, 3) solders is researched, it was found the properties of Sn- 2Ag-1Zn solder much better than Sn-1Ag-1Zn solder. So we further researched the melt and tensile properties, solder joint strength on C194 substrate and microstructure of Sn-2Ag-xZn (x=1, 2, 3, 4) solders, otherwise, these solders with 0.1 wt% Cr doping were also researched. The results show that when the Zn contains more than 3 wt%, the liquidus would be decreased while the pasty range would be enlarged. Doping of Cr will increase the liquidus slightly, has little effect in general. In the tensile test, Sn-2Ag-2Zn solder has the best strength but the worst plasticity. Increasing Zn content will improve the plasticity while decrease the tensile strength. Doping of Cr will enhance tensile strength of the all solders and improve plasticity while the Zn content higher than 2 wt%. In solder joint strength test, the as-soldered samples have similar strength. After a few days aging, the solders with high Zn content and doped with Cr have better strength. After 16 days aging, except Sn-2Ag-3Zn-0.1Cr solder, the strength of most solder joints is decreasing.
AbstractList Sn-Ag solder has been regarded as the most promising solder which can in place of Sn-Pb solder in the future, but there are reliability and cost problems limit its use. Therefore low-Ag content Sn-Ag-Cu solder, SAC105 was researched, it also has some problems. On the other hand, Sn-Ag-Zn solder has some advantages comparing with Sn-Ag-Cu solder, but the low-Ag Content Sn-Ag-Zn solder isn't reported yet. In this paper, melt and tensile properties of Sn-xAg-1Zn (x=1, 2, 3) solders is researched, it was found the properties of Sn- 2Ag-1Zn solder much better than Sn-1Ag-1Zn solder. So we further researched the melt and tensile properties, solder joint strength on C194 substrate and microstructure of Sn-2Ag-xZn (x=1, 2, 3, 4) solders, otherwise, these solders with 0.1 wt% Cr doping were also researched. The results show that when the Zn contains more than 3 wt%, the liquidus would be decreased while the pasty range would be enlarged. Doping of Cr will increase the liquidus slightly, has little effect in general. In the tensile test, Sn-2Ag-2Zn solder has the best strength but the worst plasticity. Increasing Zn content will improve the plasticity while decrease the tensile strength. Doping of Cr will enhance tensile strength of the all solders and improve plasticity while the Zn content higher than 2 wt%. In solder joint strength test, the as-soldered samples have similar strength. After a few days aging, the solders with high Zn content and doped with Cr have better strength. After 16 days aging, except Sn-2Ag-3Zn-0.1Cr solder, the strength of most solder joints is decreasing.
Author Xi Chen
Jing Hu
Ming Li
Tingbi Luo
Anmin Hu
Author_xml – sequence: 1
  surname: Tingbi Luo
  fullname: Tingbi Luo
  organization: Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
– sequence: 2
  surname: Xi Chen
  fullname: Xi Chen
  organization: Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
– sequence: 3
  surname: Jing Hu
  fullname: Jing Hu
  organization: Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
– sequence: 4
  surname: Anmin Hu
  fullname: Anmin Hu
  email: huanmin@sjtu.edu.cn
  organization: Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
– sequence: 5
  surname: Ming Li
  fullname: Ming Li
  organization: Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
BookMark eNpVj81KAzEURiMqqHVeQDd5gdT8ziQ7y9BqoaDQunFT0uSOjIzJkIxI396A3XgX3_nO5l7uDboIMQBCd4zOGaPmYd0uX3dzTosrpbkw7AxVptFMcilLMnX-z6m-QlXOn7SMVJxreY0et9O3P-IY8JjiCGnqIePY4SH-kMUHdjFMECa8DcXIe8ADWE-6BIBzHDykfIsuOztkqE6cobfVctc-k83L07pdbEjPGjUR0XmnDW1qZhtfLhcqYTqvgCrHjbeHQ00lZcKV3tRaawtOM6uZowyMEDN0_7e3B4D9mPovm47709_iFwXvS-w
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/ICEPT.2010.5582391
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Xplore POP ALL
IEEE Xplore All Conference Proceedings
IEEE Electronic Library (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE/IET Electronic Library
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EISBN 9781424481415
1424481422
1424481414
9781424481422
EndPage 404
ExternalDocumentID 5582391
Genre orig-research
GroupedDBID 6IE
6IF
6IK
6IL
6IN
AAJGR
AAWTH
ADFMO
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
IEGSK
IERZE
OCL
RIE
RIL
ID FETCH-LOGICAL-i175t-3fdc890761a7d28461a539fd5e05c29dabb604013c9da76888aec81a81c01e933
IEDL.DBID RIE
ISBN 9781424481408
1424481406
IngestDate Wed Aug 27 03:07:13 EDT 2025
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i175t-3fdc890761a7d28461a539fd5e05c29dabb604013c9da76888aec81a81c01e933
PageCount 6
ParticipantIDs ieee_primary_5582391
PublicationCentury 2000
PublicationDate 2010-Aug.
PublicationDateYYYYMMDD 2010-08-01
PublicationDate_xml – month: 08
  year: 2010
  text: 2010-Aug.
PublicationDecade 2010
PublicationTitle 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging
PublicationTitleAbbrev ICEPT
PublicationYear 2010
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0000452284
Score 1.4468106
Snippet Sn-Ag solder has been regarded as the most promising solder which can in place of Sn-Pb solder in the future, but there are reliability and cost problems limit...
SourceID ieee
SourceType Publisher
StartPage 399
SubjectTerms Aging
Chromium
Doping
Microstructure
Soldering
Zinc
Title Study on properties of low-Ag content Sn-Ag-Zn lead-free solders
URI https://ieeexplore.ieee.org/document/5582391
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1JSwMxGA21J08qrbiTg0fTZmaSaXJTSksVKgVbKF5KJouIZaaUGUR_vflmqSgePGU5hGTmg2_Jey8IXavA-TBBBcT4bIEwoQ2RnDlCLePMSCqMgzrk9DGeLNjDki9b6GbHhbHWluAz24NueZdvMl1AqazPuQgjoKrveTOruFq7ekopDS5Yw90CIae4kXSqx6IhzVDZvx-OZvMK2VWv-uN5ldK7jA_QtNlXBSp56xV50tOfvyQb_7vxQ9T95vHh2c5DHaGWTTvoFqCDHzhL8QYK8VtQVMWZw-vsndy9YMCu-8XwU-pH5DnFa28FxG2txd5MAfbcRYvxaD6ckPodBfLqg4OcRM5oIaFgoQbGfyPf8kg6wy3lOpRGJUlMIc_Svu_TDyGU1SJQItA0sDKKjlE7zVJ7gnAsXUAdhaBSMMXjxPh4cmCSUOrQGetOUQdOv9pUUhmr-uBnf0-fo_3qMh7wdBeonW8Le-l9fJ5clT_3C4tzoOc
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NS8MwGA5jHvSksonf5uDRbGmbdMlNGRtTtzFwg-FltPkQcbRjdIj-evP2Y6J48NSkh5C0gfd9nzzPE4SuI8-6NCHyiHbVAmFCaSI5s4QaxpmWVGgLOORoHA5m7GHO5zV0s9XCGGNy8plpQTM_y9ep2gBU1uZc-AFI1Xdc3Ge8UGttEZXcHFywSr0FVk5hZepU9kUlm6Gyfd_tTaYFt6sc98cFK3l86e-jUTWzglby1tpkcUt9_jJt_O_UD1DzW8mHJ9sYdYhqJmmgWyAPfuA0wSuA4tfgqYpTi5fpO7l7wcBed4Php8T1yHOCl24fELs2BruNCsTnJpr1e9PugJQ3KZBXlx5kJLBaCQmQRdTR7hu5Jw-k1dxQrnypozgOKVRayrVdASJEZJTwIuEp6hkZBEeonqSJOUY4lNajlkJaKVjEw1i7jLKjY18q32pjT1ADVr9YFWYZi3Lhp3-_vkK7g-louBjejx_P0F5xNA_sunNUz9Ybc-EifhZf5j_6CzC0pDQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2010+11th+International+Conference+on+Electronic+Packaging+Technology+and+High+Density+Packaging&rft.atitle=Study+on+properties+of+low-Ag+content+Sn-Ag-Zn+lead-free+solders&rft.au=Tingbi+Luo&rft.au=Xi+Chen&rft.au=Jing+Hu&rft.au=Anmin+Hu&rft.date=2010-08-01&rft.pub=IEEE&rft.isbn=9781424481408&rft.spage=399&rft.epage=404&rft_id=info:doi/10.1109%2FICEPT.2010.5582391&rft.externalDocID=5582391
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781424481408/lc.gif&client=summon&freeimage=true
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781424481408/mc.gif&client=summon&freeimage=true
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781424481408/sc.gif&client=summon&freeimage=true