APA (7th ed.) Citation

Luo, T., Chen, X., Hu, J., Hu, A., & Li, M. (2010, August). Study on properties of low-Ag content Sn-Ag-Zn lead-free solders. 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 399-404. https://doi.org/10.1109/ICEPT.2010.5582391

Chicago Style (17th ed.) Citation

Luo, Tingbi, Xi Chen, Jing Hu, Anmin Hu, and Ming Li. "Study on Properties of Low-Ag Content Sn-Ag-Zn Lead-free Solders." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 399-404. https://doi.org/10.1109/ICEPT.2010.5582391.

MLA (9th ed.) Citation

Luo, Tingbi, et al. "Study on Properties of Low-Ag Content Sn-Ag-Zn Lead-free Solders." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 399-404, https://doi.org/10.1109/ICEPT.2010.5582391.