Ore, S. H., Zhu, W. H., Yuan, W. L., & Suthiwongsunthorn, N. (2010, August). A new tool development for the thermal design and quick performance evaluation of FBGA devices. 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 698-703. https://doi.org/10.1109/ICEPT.2010.5582855
Chicago Style (17th ed.) CitationOre, Siew Hoon, W H. Zhu, W L. Yuan, and Nathapong Suthiwongsunthorn. "A New Tool Development for the Thermal Design and Quick Performance Evaluation of FBGA Devices." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 698-703. https://doi.org/10.1109/ICEPT.2010.5582855.
MLA (9th ed.) CitationOre, Siew Hoon, et al. "A New Tool Development for the Thermal Design and Quick Performance Evaluation of FBGA Devices." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 698-703, https://doi.org/10.1109/ICEPT.2010.5582855.