Semi-automatic copper foil surface roughness detection from PCB microsection images

Characterization of surface roughness of printed circuit board (PCB) conductors is an important task as a part of signal-integrity analysis on high-speed multi-GHz designs. However, there are no methods to adequately quantify roughness of a signal trace or a power/reference plane layer within finish...

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Published in2012 IEEE International Symposium on Electromagnetic Compatibility pp. 132 - 137
Main Authors Soumya De, Gafarov, A., Koledintseva, M. Y., Stanley, R. J., Drewniak, J. L., Hinaga, S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2012
Subjects
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ISBN9781467320610
1467320617
ISSN2158-110X
DOI10.1109/ISEMC.2012.6351796

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Abstract Characterization of surface roughness of printed circuit board (PCB) conductors is an important task as a part of signal-integrity analysis on high-speed multi-GHz designs. However, there are no methods to adequately quantify roughness of a signal trace or a power/reference plane layer within finished PCBs. Foil roughness characterization techniques currently available can only be applied to the base foil, prior to its incorporation into a finished board. In a finished PCB, a foil surface is not directly accessible, as it is embedded in the dielectric of the board, and attempting to expose the surface will damage the board and the surface of interest. In this paper, a method of surface roughness quantification from microsectioned samples of PCBs is presented. A small, non-functional area, e.g., a corner of the PCB, can be removed, and the surface roughness of the circuit layers can be assessed without impairing the function of the PCB. In the proposed method, a conductor (a trace or a plane) in the microsectioned sample is first digitally photographed at high magnification. The digital photo obtained is then used as an input to a signal- and image-processing algorithm within a graphical user interface. The GUI-based tool automatically computes and returns the surface roughness values of the layer photographed. The tool enables the user to examine the surface textures of the two sides of the conductor independently. In the case of a trace, the composite value of roughness, based on the entire perimeter of the trace cross-section, can be calculated.
AbstractList Characterization of surface roughness of printed circuit board (PCB) conductors is an important task as a part of signal-integrity analysis on high-speed multi-GHz designs. However, there are no methods to adequately quantify roughness of a signal trace or a power/reference plane layer within finished PCBs. Foil roughness characterization techniques currently available can only be applied to the base foil, prior to its incorporation into a finished board. In a finished PCB, a foil surface is not directly accessible, as it is embedded in the dielectric of the board, and attempting to expose the surface will damage the board and the surface of interest. In this paper, a method of surface roughness quantification from microsectioned samples of PCBs is presented. A small, non-functional area, e.g., a corner of the PCB, can be removed, and the surface roughness of the circuit layers can be assessed without impairing the function of the PCB. In the proposed method, a conductor (a trace or a plane) in the microsectioned sample is first digitally photographed at high magnification. The digital photo obtained is then used as an input to a signal- and image-processing algorithm within a graphical user interface. The GUI-based tool automatically computes and returns the surface roughness values of the layer photographed. The tool enables the user to examine the surface textures of the two sides of the conductor independently. In the case of a trace, the composite value of roughness, based on the entire perimeter of the trace cross-section, can be calculated.
Author Hinaga, S.
Stanley, R. J.
Drewniak, J. L.
Soumya De
Koledintseva, M. Y.
Gafarov, A.
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Snippet Characterization of surface roughness of printed circuit board (PCB) conductors is an important task as a part of signal-integrity analysis on high-speed...
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StartPage 132
SubjectTerms Conductors
Copper
Dielectric losses
Rough surfaces
Surface roughness
Title Semi-automatic copper foil surface roughness detection from PCB microsection images
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