Integrated heat sinks for SOI power devices

• Published in: 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) pp. 285 - 288
• Main Authors: Liang Yan, Koops, Gerhard, Steeneken, Peter, Heringa, Anco, Surdeanu, Radu, van Dijk, Luc
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2013
• Subjects: Heat sinks; Resistance heating; Silicon-on-insulator; Temperature measurement; Thermal conductivity; Thermal resistance; Transistors

Silicon on insulator (SOI) technology for power devices offers many distinct advantages compared to bulk Si technology, however in high power applications the buried oxide (BOX) layer can impede heat transport towards the backside of the silicon substrate. This paper demonstrates integration of heat...