A wide frequency band characterization technique for multiple-terminal discrete decoupling capacitors
This paper describes an effective characterization method developed for frequency-dependent electrical characteristics of multiple-terminal chip capacitors used widely in power delivery networks in today's high-speed digital applications. This technique achieves excellent accuracy across a wide...
Saved in:
Published in | 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) pp. 389 - 392 |
---|---|
Main Authors | , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.12.2012
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | This paper describes an effective characterization method developed for frequency-dependent electrical characteristics of multiple-terminal chip capacitors used widely in power delivery networks in today's high-speed digital applications. This technique achieves excellent accuracy across a wide frequency range in the chip capacitor application on a digital ASIC substrate compared to conventional ESR and ESL extraction methods. To ensure the developed circuit models cover the wide frequency range, multiple branches of RLC elements are proposed to capture the higher-order frequency response of the chip capacitor impedance. The characterization procedure consists of carefully designed test fixtures, two-port VNA measurements, a de-embedding process, and circuit modeling and simulation. Simulation results demonstrated using this method is further correlated with a frequency limited de-embedded s-parameters from measurements. |
---|---|
AbstractList | This paper describes an effective characterization method developed for frequency-dependent electrical characteristics of multiple-terminal chip capacitors used widely in power delivery networks in today's high-speed digital applications. This technique achieves excellent accuracy across a wide frequency range in the chip capacitor application on a digital ASIC substrate compared to conventional ESR and ESL extraction methods. To ensure the developed circuit models cover the wide frequency range, multiple branches of RLC elements are proposed to capture the higher-order frequency response of the chip capacitor impedance. The characterization procedure consists of carefully designed test fixtures, two-port VNA measurements, a de-embedding process, and circuit modeling and simulation. Simulation results demonstrated using this method is further correlated with a frequency limited de-embedded s-parameters from measurements. |
Author | Hui-Ying Ng Wui-Weng Wong |
Author_xml | – sequence: 1 surname: Hui-Ying Ng fullname: Hui-Ying Ng organization: Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore – sequence: 2 surname: Wui-Weng Wong fullname: Wui-Weng Wong organization: Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore |
BookMark | eNpVUM1KxDAYjKigrn0A8ZIX6JqvaZPmuJT1Bxb0sJ6XbPLFjbRpTVNkfXoL7sXTMMPMMMwNuQh9QELugC0BmHpYv22bZcGgWIqKSQB-RjIlayiF5GVVFXD-j_P6imTj-MkYm-NCFeU1wRX99hapi_g1YTBHutfBUnPQUZuE0f_o5PtAE5pD8LOFuj7SbmqTH1rMZ0fng26p9aOJmJBaNP00tD58UKMHbXzq43hLLp1uR8xOuCDvj-tt85xvXp9emtUm9yCrlIOVrFJ7p2tlXcGFLRRnZhZKp6SygtXzaMmAWy1KUUsFMwGJSkAlRKn4gtz_9XpE3A3Rdzoed6dz-C_i4Vop |
ContentType | Conference Proceeding |
DBID | 6IE 6IL CBEJK RIE RIL |
DOI | 10.1109/EPTC.2012.6507113 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library Online IEEE Proceedings Order Plans (POP All) 1998-Present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library Online url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISBN | 9781467345521 1467345520 9781467345514 1467345512 |
EndPage | 392 |
ExternalDocumentID | 6507113 |
Genre | orig-research |
GroupedDBID | 6IE 6IF 6IK 6IL 6IN AAJGR ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK IEGSK IERZE OCL RIE RIL |
ID | FETCH-LOGICAL-i175t-1d7059bfa89df236d2930c9bf4f979d6086927013da646879170117e961566493 |
IEDL.DBID | RIE |
ISBN | 9781467345538 1467345539 |
IngestDate | Wed Jun 26 19:23:48 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i175t-1d7059bfa89df236d2930c9bf4f979d6086927013da646879170117e961566493 |
PageCount | 4 |
ParticipantIDs | ieee_primary_6507113 |
PublicationCentury | 2000 |
PublicationDate | 2012-Dec. |
PublicationDateYYYYMMDD | 2012-12-01 |
PublicationDate_xml | – month: 12 year: 2012 text: 2012-Dec. |
PublicationDecade | 2010 |
PublicationTitle | 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) |
PublicationTitleAbbrev | EPTC |
PublicationYear | 2012 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
SSID | ssj0001106924 |
Score | 1.5444278 |
Snippet | This paper describes an effective characterization method developed for frequency-dependent electrical characteristics of multiple-terminal chip capacitors... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 389 |
SubjectTerms | Conferences Decision support systems Electronics packaging |
Title | A wide frequency band characterization technique for multiple-terminal discrete decoupling capacitors |
URI | https://ieeexplore.ieee.org/document/6507113 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NS8NAEF1qT3rxoxW_2YNHk6bZzW72KKWlCJUeWuitZD8iRUmlJBT99c4kaariwVuygbDshsyb2ffeEHLv4I8nQpV4gU2dx7l1XhIYLIfZmHGj4RGKkyfPYjznT4to0SIPjRbGOVeSz5yPl-VZvl2bAktlPYHgBVvUHkglKq3Wvp4CuQ3kEqV2S0jGo4ipnaVTfR_Xp5r9QPWG09kAiV2hX7_0R3eVMriMjslkN62KU_LqF7n2zecvx8b_zvuEdPcyPjptAtQpabnsjBx9cyDsEPdItyvraLqpKNUfVCeZpaaxca5UmrSxeqUAcumOhejVVJo3iuLeDeBvaiGdLVDl-0INxGGzwm4-XTIfDWeDsVd3XvBWACdyr28lwC6dJrGyaciEBVAQGBjgqZLKCsiDVCgBPdpEcBFLha7ufemUwHSQK3ZO2tk6cxeEGqtEbCPHTAzQS8sEEaDWAGMiyQxTl6SDC7Z8r8w1lvVaXf09fE0OcdMqPskNaeebwt0CKsj1Xfk5fAEmC7O4 |
link.rule.ids | 309,310,780,784,789,790,796,27925,54758 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFA5jHtSLPzbxtzl4tF3XpElzlLExdRs7bLDbaH5UhtJJaRH9631pu07Fg7c2hRKS0ve9l-_7HkK3Bv54zBeR4-nYOJRq40SesuUwHRKqJDyy4uTxhA3n9HERLBrortbCGGMK8plx7WVxlq_XKrelsg6z4MW2qN0JKODcUq21rahAdgPZRKHeYpzQICBiY-pU3YfVuWbXE53-dNaz1C7frV77o79KEV4GB2i8mVjJKnlx80y66vOXZ-N_Z36I2lshH57WIeoINUxyjPa_eRC2kLnH7yttcJyWpOoPLKNEY1UbOZc6TVybvWKAuXjDQ3QqMs0rtvLeFBA41pDQ5lbn-4wVRGK1sv182mg-6M96Q6fqveCsAFBkTldzAF4yjkKhY58wDbDAUzBAY8GFZpAJCZ8DftQRoyzkwvq6d7kRzCaEVJAT1EzWiTlFWGnBQh0YokIAX5JHFgNKCUAm4EQRcYZadsGWb6W9xrJaq_O_h2_Q7nA2Hi1HD5OnC7RnN7Bkl1yiZpbm5gowQiavi0_jC85ctws |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2012+IEEE+14th+Electronics+Packaging+Technology+Conference+%28EPTC%29&rft.atitle=A+wide+frequency+band+characterization+technique+for+multiple-terminal+discrete+decoupling+capacitors&rft.au=Hui-Ying+Ng&rft.au=Wui-Weng+Wong&rft.date=2012-12-01&rft.pub=IEEE&rft.isbn=9781467345538&rft.spage=389&rft.epage=392&rft_id=info:doi/10.1109%2FEPTC.2012.6507113&rft.externalDocID=6507113 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781467345538/lc.gif&client=summon&freeimage=true |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781467345538/mc.gif&client=summon&freeimage=true |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781467345538/sc.gif&client=summon&freeimage=true |