Reliable HT electronic packaging - Optimization of a Au-Sn SLID joint

Au-Sn solid-liquid-interdiffusion (SLID) bonding has proven to be a favorable die attach and interconnect technology for high temperature (HT) applications. In combination with silicon carbide (SiC) devices, Au-Sn SLID bonding has potential to be a key technology in future HT electronic systems. In...

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Bibliographic Details
Published in2012 4th Electronic System-Integration Technology Conference pp. 1 - 6
Main Authors Tollefsen, Torleif A., Taklo, Maaike M. Visser, Aasmundtveit, Knut E., Larsson, Andreas
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2012
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ISBN1467346454
9781467346450
DOI10.1109/ESTC.2012.6542138

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