APA (7th ed.) Citation

Tollefsen, T. A., Taklo, M. M. V., Aasmundtveit, K. E., & Larsson, A. (2012, September). Reliable HT electronic packaging - Optimization of a Au-Sn SLID joint. 2012 4th Electronic System-Integration Technology Conference, 1-6. https://doi.org/10.1109/ESTC.2012.6542138

Chicago Style (17th ed.) Citation

Tollefsen, Torleif A., Maaike M. Visser Taklo, Knut E. Aasmundtveit, and Andreas Larsson. "Reliable HT Electronic Packaging - Optimization of a Au-Sn SLID Joint." 2012 4th Electronic System-Integration Technology Conference Sep. 2012: 1-6. https://doi.org/10.1109/ESTC.2012.6542138.

MLA (9th ed.) Citation

Tollefsen, Torleif A., et al. "Reliable HT Electronic Packaging - Optimization of a Au-Sn SLID Joint." 2012 4th Electronic System-Integration Technology Conference, Sep. 2012, pp. 1-6, https://doi.org/10.1109/ESTC.2012.6542138.