Vacuum Wafer Level Packaged Two-Dimensional Optical Scanner by Anodic Bonding
Vacuum wafer-level packaged two-dimensional optical scanners actuated by vertical electrostatic combs have been developed. A 1 mm-diameter gimbal mirror with high frequency deflection and a surrounding 2.5times3 mm movable frame with low frequency deflection are fabricated in a SOI wafer. Wafer-leve...
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Published in | 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems pp. 959 - 962 |
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Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.01.2009
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Subjects | |
Online Access | Get full text |
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