Vacuum Wafer Level Packaged Two-Dimensional Optical Scanner by Anodic Bonding

• Published in: 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems pp. 959 - 962
• Main Authors: Tachibana, H., Kawano, K., Ueda, H., Noge, H.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.01.2009
• Subjects: Electrostatics; Glass; High speed optical techniques; Mirrors; Optical sensors; Packaging; Resonant frequency; Voltage; Wafer bonding; Wafer scale integration

Vacuum wafer-level packaged two-dimensional optical scanners actuated by vertical electrostatic combs have been developed. A 1 mm-diameter gimbal mirror with high frequency deflection and a surrounding 2.5times3 mm movable frame with low frequency deflection are fabricated in a SOI wafer. Wafer-leve...