Vacuum Wafer Level Packaged Two-Dimensional Optical Scanner by Anodic Bonding

Vacuum wafer-level packaged two-dimensional optical scanners actuated by vertical electrostatic combs have been developed. A 1 mm-diameter gimbal mirror with high frequency deflection and a surrounding 2.5times3 mm movable frame with low frequency deflection are fabricated in a SOI wafer. Wafer-leve...

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Bibliographic Details
Published in2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems pp. 959 - 962
Main Authors Tachibana, H., Kawano, K., Ueda, H., Noge, H.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2009
Subjects
Electrostatics
Glass
High speed optical techniques
Mirrors
Optical sensors
Packaging
Resonant frequency
Voltage
Wafer bonding
Wafer scale integration
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Summary:Vacuum wafer-level packaged two-dimensional optical scanners actuated by vertical electrostatic combs have been developed. A 1 mm-diameter gimbal mirror with high frequency deflection and a surrounding 2.5times3 mm movable frame with low frequency deflection are fabricated in a SOI wafer. Wafer-level packaging with anodically bonded borosilicate glass substrates on both sides together with non-evaporable getters fixed on the lower glass substrate allows hermetic sealing in high vacuum. The gimbal mirror and the movable frame are both deflected mechanically plusmn12 deg. at a resonant frequency of 25.1 kHz with a driving voltage of 18 V, and at a resonant frequency of 78.6 Hz with a driving voltage of 10 V, respectively. The internal pressure of the device is 20 Pa.
ISBN:1424429773
9781424429776
ISSN:1084-6999
DOI:10.1109/MEMSYS.2009.4805544