Integrity analysis of solder joints; fracture mechanics approach

• Published in: Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) pp. 404 - 411
• Main Authors: Dong-Hak Kim, Ki-Ju Kang, Youn-Young Earmme
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2001
• Subjects: Electronic packaging thermal management; Electronics packaging; Fatigue; Finite element methods; Mechanical engineering; Plastics; Soldering; Stress; Testing; Thermal loading

Brass/solder/brass sandwich CTS (compact tension-shear) specimens were fracture tested under various loading angles. The fracture toughness vs. mode mixity relation is asymmetric and the crack often jumps from the one interface to the other as the fracture proceeds. Because the toughness is exceptio...