Modeling of Spreading Behavior of UV-Curable Dielectric Ink from its Rheological Characteristics

• Published in: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) pp. 774 - 779
• Main Authors: Kang, Sujie, Lee, Jung Shin, Woo Cho, Jung, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Rhee, Daniel Minwoo
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2022
• Subjects: additive manufacturing; advanced packaging; Analytical models; Behavioral sciences; inkjet printing; Liquids; photo-imageable dielectric; redistribution layer; Temperature measurement; Three-dimensional displays; Time measurement; Viscosity

In the 2.5D packages, panel-level redistribution layer interposers without through silicon via has been drawn great attention due to cost-effectiveness and productivity. The conventional production method requires photo-imageable dielectric patterning, which involves high process cost and material c...