A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms
A low-power and real-time 3D object recognition with RGBD data acquisition system-on-chip (SoC) is proposed. By synthesizing dense RGB-D data through monocular depth estimation, the proposed system reduces the sensor power for 3D data acquisition by ×27.3 lower. Moreover, the proposed processor redu...
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Published in | 2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) pp. 1 - 3 |
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Main Authors | , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
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IEEE
20.04.2022
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Abstract | A low-power and real-time 3D object recognition with RGBD data acquisition system-on-chip (SoC) is proposed. By synthesizing dense RGB-D data through monocular depth estimation, the proposed system reduces the sensor power for 3D data acquisition by ×27.3 lower. Moreover, the proposed processor reduces the energy consumption of a point cloud based neural network (PNN) exploiting bit-slice-level computation and a point feature reuse method with a pipelined architecture. Additionally, the processor supports the point sampling and grouping algorithms of the PNN with a unified point processing core. Finally, the processor achieves 210.0 mW while implementing 34.0 frame-per-second (fps) end-to-end RGB-D acquisition and 3D object recognition. |
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AbstractList | A low-power and real-time 3D object recognition with RGBD data acquisition system-on-chip (SoC) is proposed. By synthesizing dense RGB-D data through monocular depth estimation, the proposed system reduces the sensor power for 3D data acquisition by ×27.3 lower. Moreover, the proposed processor reduces the energy consumption of a point cloud based neural network (PNN) exploiting bit-slice-level computation and a point feature reuse method with a pipelined architecture. Additionally, the processor supports the point sampling and grouping algorithms of the PNN with a unified point processing core. Finally, the processor achieves 210.0 mW while implementing 34.0 frame-per-second (fps) end-to-end RGB-D acquisition and 3D object recognition. |
Author | Lee, Jinsu Im, Dongseok Ryu, Junha Kang, Sanghoon Park, Wonhoon Kwon, Hankyul Han, Donghyeon Park, Gwangtae Li, Zhiyong Yoo, Hoi-Jun |
Author_xml | – sequence: 1 givenname: Dongseok surname: Im fullname: Im, Dongseok email: dsim@kaist.ac.kr organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 2 givenname: Gwangtae surname: Park fullname: Park, Gwangtae organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 3 givenname: Junha surname: Ryu fullname: Ryu, Junha organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 4 givenname: Zhiyong surname: Li fullname: Li, Zhiyong organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 5 givenname: Sanghoon surname: Kang fullname: Kang, Sanghoon organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 6 givenname: Donghyeon surname: Han fullname: Han, Donghyeon organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 7 givenname: Jinsu surname: Lee fullname: Lee, Jinsu organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 8 givenname: Wonhoon surname: Park fullname: Park, Wonhoon organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 9 givenname: Hankyul surname: Kwon fullname: Kwon, Hankyul organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea – sequence: 10 givenname: Hoi-Jun surname: Yoo fullname: Yoo, Hoi-Jun organization: School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea |
BookMark | eNotkF1LwzAYRqMoOOd-gTcBrzuTvmk-Lmen26DSMfV6pOlbzeia2VSG_15hu3rgcDgXzy256kKHhDxwNuWcmce8LIt8uVq_ZQIgnaYsTadGqVRKdUEmRmkuZSa40Sa7JKNUKEiE1HBDJjHuGGPADWMpjEiY0SIck0M4Yk9tV9MN2jYZ_B4pzGlZ7dAN_8yFz84PPnR03QeHMYaeHv3wRefYRaSbxVMyp3M7WDpz3z8-nlzf0ddQ-RbpurVDE_p9vCPXjW0jTs47Jh8vz-_5MinKxSqfFYnnAEMCWte2boQ2wBmvHVRKA1SOa-RCWGs4sw1z3NROoZOq5jJrZA1aMZRCMxiT-1PXI-L20Pu97X-354vgD__XXZ0 |
ContentType | Conference Proceeding |
DBID | 6IE 6IL CBEJK RIE RIL |
DOI | 10.1109/COOLCHIPS54332.2022.9772667 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library Online IEEE Proceedings Order Plans (POP All) 1998-Present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library Online url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
EISBN | 9781665419895 166541989X |
EISSN | 2473-4683 |
EndPage | 3 |
ExternalDocumentID | 9772667 |
Genre | orig-research |
GroupedDBID | 6IE 6IF 6IL 6IN AAJGR ABLEC ADZIZ ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK CHZPO IEGSK OCL RIE RIL |
ID | FETCH-LOGICAL-i133t-388dadf4893101dc3b7833bc18e144aa910af0c19dc7ec67d165f6d3870e64803 |
IEDL.DBID | RIE |
IngestDate | Wed Jun 26 19:30:59 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i133t-388dadf4893101dc3b7833bc18e144aa910af0c19dc7ec67d165f6d3870e64803 |
PageCount | 3 |
ParticipantIDs | ieee_primary_9772667 |
PublicationCentury | 2000 |
PublicationDate | 2022-April-20 |
PublicationDateYYYYMMDD | 2022-04-20 |
PublicationDate_xml | – month: 04 year: 2022 text: 2022-April-20 day: 20 |
PublicationDecade | 2020 |
PublicationTitle | 2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) |
PublicationTitleAbbrev | COOL CHIPS |
PublicationYear | 2022 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
SSID | ssj0003190023 |
Score | 1.8391706 |
Snippet | A low-power and real-time 3D object recognition with RGBD data acquisition system-on-chip (SoC) is proposed. By synthesizing dense RGB-D data through monocular... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 1 |
SubjectTerms | Computer architecture Data acquisition Energy consumption Estimation Neural networks Point cloud compression Three-dimensional displays |
Title | A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms |
URI | https://ieeexplore.ieee.org/document/9772667 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NS8NAEF3aHsSTSit-M6BHN02z-dgca2Ot0tpSLfRW9itQlKTWBMFf726SVhQP3kIgYdnN5s2bffMGoSsTA7jC6Px818dubDPMHEIwlTLoKA1YVBVun4_-YOY-zL15DV1va2GUUoX4TFnmsjjLl6nITaqsrWMVjSdBHdWDMCxrtbb5FP0pGfzZQZeVjWa7Nx4Pe4P7yZNnPLo0FXQcq3rDj1YqBZL099BoM4ZSQPJi5Rm3xOcve8b_DnIftb5r9mCyRaMDVFNJE6VdGKYfeGVaoQFLJEx1XIhNP3kgEYy5ScLAdKMhShOo6gbSNZgELUSa5CqY3t3gCCKWMeiKt3xZyrxgmcAo5fqvApNXlpng972FZv3b594AVy0W8FKT0wwTSiWTsXGg0XtTCsIDSggXHao002JMBxMstkUnlCJQwg9kx_diXxK9y5XvUpscokaSJuoIAbd5HHKqpCRCP0lYwDWdFMJTnuNxSY9R00zWYlW6aCyqeTr5-_Yp2jULZs5tHPsMNbJ1rs41_Gf8olj3LyjhrvI |
link.rule.ids | 310,311,783,787,792,793,799,27937,55086 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1JS8NAFB5cQD2ptOLuAz06bZrJMh61sabajdqCtzJboCiJS4rgr_dNGiuKB28hkDBMZvJ935v3vkfImeUAnrJ5foEXUC9xBBUuY5RrHTYMAhY3hdtnL4jH3u2D_7BEzhe1MMaYIvnM1OxlcZavMzWzobI6chXEk3CZrCKv5sG8WmsRUcHFZBFojZyWRpr1Zr_facbtwb1vXbpQDLpurXzHj2YqBZa0Nkn3axTzFJLH2iyXNfXxy6Dxv8PcItXvqj0YLPBomyyZtEKyS-hk7_TZNkMDkWoYIjOktqM8sAj60oZhYPiVRZSlUFYOZK9gQ7QQocw1MLy5ohFEIhdwqV5m03miF0xT6GYS_ysweBK5pb9vVTJuXY-aMS2bLNApytOcMs610In1oMHdqRWTIWdMqgY3qLWEQDohEkc1LrQKjQpC3Qj8JNAM97kJPO6wHbKSZqnZJSAdmVxIbrRmCp9kIpQoKJXyje_6UvM9UrGTNXme-2hMynna__v2CVmPR93OpNPu3R2QDfvx7CmO6xySlfx1Zo6QDOTyuFgDn3vxsj0 |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2022+IEEE+Symposium+in+Low-Power+and+High-Speed+Chips+%28COOL+CHIPS%29&rft.atitle=A+Low-power+and+Real-time+3D+Object+Recognition+Processor+with+Dense+RGB-D+Data+Acquisition+in+Mobile+Platforms&rft.au=Im%2C+Dongseok&rft.au=Park%2C+Gwangtae&rft.au=Ryu%2C+Junha&rft.au=Li%2C+Zhiyong&rft.date=2022-04-20&rft.pub=IEEE&rft.eissn=2473-4683&rft.spage=1&rft.epage=3&rft_id=info:doi/10.1109%2FCOOLCHIPS54332.2022.9772667&rft.externalDocID=9772667 |