The investigation of semiconductor shipping bag reliability

The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semic...

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Published in2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) pp. 935 - 938
Main Authors Gao, Hailin Jonson, Zhang, Xueliang Ruben, Yu, Yanju Lisa, Chang, Kaiyuan Kevin, Chien, Wei-Ting Kary
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2015
Subjects
Moisture
puncture strength
Raw materials
reliability
Resistance
Semiconductor device reliability
Shipping bag
Tensile strength
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DOI10.1109/IEEM.2015.7385786

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Abstract The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semiconductor industry because of its high reliability. However, with the technology advancement, the packing of a large size of IC wafers is inevitable, which brings a new challenge to its resistance to a greater load of shipping and dropping. To reduce the failure rate of MBB leakage during shipment, we evaluate the physical and tensile strength of the shipping bag composed of different films. We significantly improved MBB by optimizing its raw material, which is the first time such approach with plausible results is reported.
AbstractList The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semiconductor industry because of its high reliability. However, with the technology advancement, the packing of a large size of IC wafers is inevitable, which brings a new challenge to its resistance to a greater load of shipping and dropping. To reduce the failure rate of MBB leakage during shipment, we evaluate the physical and tensile strength of the shipping bag composed of different films. We significantly improved MBB by optimizing its raw material, which is the first time such approach with plausible results is reported.
Author Chien, Wei-Ting Kary
Chang, Kaiyuan Kevin
Gao, Hailin Jonson
Yu, Yanju Lisa
Zhang, Xueliang Ruben
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Snippet The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after...
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SubjectTerms Moisture
puncture strength
Raw materials
reliability
Resistance
Semiconductor device reliability
Shipping bag
Tensile strength
Title The investigation of semiconductor shipping bag reliability
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