Fabrication of High-speed Signal Transmission Rigid Substrate by Silver-seed Copper Plating Technique

Cu signal transmission line with a flat and smooth substrate/copper interface and high adhesion strength was fabricated on a low-loss type rigid substrate by using newly developed silver-seed plating technique. The microstrip lines by silver-seed method showed better transmission characteristics tha...

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Bibliographic Details
Published in2023 International Conference on Electronics Packaging (ICEP) pp. 157 - 158
Main Authors Tamura, Rei, Fukazawa, Norimasa, Fujikawa, Wataru
Format Conference Proceeding
LanguageEnglish
Published Japan Institute of Electronics Packaging 19.04.2023
Subjects
Conductors
Copper-Clad Laminates (CCL)
High-Speed Transmission
Plating
Power transmission lines
Printed Wiring boards (PWB)
Propagation losses
Silver-seed
Silver-seed Semi-Additive Process (S-SAP)
Smoothing methods
Surface morphology
Wiring
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Summary:Cu signal transmission line with a flat and smooth substrate/copper interface and high adhesion strength was fabricated on a low-loss type rigid substrate by using newly developed silver-seed plating technique. The microstrip lines by silver-seed method showed better transmission characteristics than that fabricated with commercial CCL of same PPE type substrate. The importance of the surface morphology of conductor line for low signal transmission loss is experimentally confirmed. Silver-seed plating technique, which enables the formation of flat and smooth electric conductors, is expected to be useful for the formation of high-speed transmission wiring on a rigid substrate.
DOI:10.23919/ICEP58572.2023.10129661