Optimizing Device Metal Routing Layouts by the Simulation Tool

• Published in: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) pp. 219 - 220
• Main Authors: Huang, Shao-Chang, Li, Ching-Ho, Liao, Chih-Cherng, Chuang, Jung-Tsun, Wang, Chien-Wei, Lin, Gong-Kai, Chen, Lin-Fan, Chen, Chun-Chih, Ho, Kuan-I, Chang, Che-Hua, Yang, Hsiao-Ying, Lao, Chung-Ren, Lee, Jian-Hsing, Chen, Ke-Horng
• Format: Conference Proceeding
• Language: English
• Published: IEEE 17.07.2023
• Subjects: Fingers; Integrated circuits; Layout; Metals; Performance evaluation; Resistance; Simulation

Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study, simple device layouts with only two poly gate fingers are discovered for obtaining the optimizing device characteristics. In order to create t...