Optimizing Device Metal Routing Layouts by the Simulation Tool

Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study, simple device layouts with only two poly gate fingers are discovered for obtaining the optimizing device characteristics. In order to create t...

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Published in2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) pp. 219 - 220
Main Authors Huang, Shao-Chang, Li, Ching-Ho, Liao, Chih-Cherng, Chuang, Jung-Tsun, Wang, Chien-Wei, Lin, Gong-Kai, Chen, Lin-Fan, Chen, Chun-Chih, Ho, Kuan-I, Chang, Che-Hua, Yang, Hsiao-Ying, Lao, Chung-Ren, Lee, Jian-Hsing, Chen, Ke-Horng
Format Conference Proceeding
LanguageEnglish
Published IEEE 17.07.2023
Subjects
Fingers
Integrated circuits
Layout
Metals
Performance evaluation
Resistance
Simulation
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Abstract Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study, simple device layouts with only two poly gate fingers are discovered for obtaining the optimizing device characteristics. In order to create the uniform current distributions, lots of metal routing segmentations are preferred, but many segmented metal layouts will induce less effective metal widths. Through the simulation tool, optimizing metal routing can be achieved. Finally, one suggested metal routing method for typical IC applications can be obtained from many simulation results.
AbstractList Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study, simple device layouts with only two poly gate fingers are discovered for obtaining the optimizing device characteristics. In order to create the uniform current distributions, lots of metal routing segmentations are preferred, but many segmented metal layouts will induce less effective metal widths. Through the simulation tool, optimizing metal routing can be achieved. Finally, one suggested metal routing method for typical IC applications can be obtained from many simulation results.
Author Lee, Jian-Hsing
Chen, Ke-Horng
Chen, Lin-Fan
Chen, Chun-Chih
Ho, Kuan-I
Huang, Shao-Chang
Wang, Chien-Wei
Liao, Chih-Cherng
Chuang, Jung-Tsun
Chang, Che-Hua
Li, Ching-Ho
Yang, Hsiao-Ying
Lao, Chung-Ren
Lin, Gong-Kai
Author_xml – sequence: 1
  givenname: Shao-Chang
  surname: Huang
  fullname: Huang, Shao-Chang
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 2
  givenname: Ching-Ho
  surname: Li
  fullname: Li, Ching-Ho
  organization: National Yang Ming Chiao Tung University,Institute of Electrical and Control Engineering,Hsinchu,Taiwan
– sequence: 3
  givenname: Chih-Cherng
  surname: Liao
  fullname: Liao, Chih-Cherng
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 4
  givenname: Jung-Tsun
  surname: Chuang
  fullname: Chuang, Jung-Tsun
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 5
  givenname: Chien-Wei
  surname: Wang
  fullname: Wang, Chien-Wei
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 6
  givenname: Gong-Kai
  surname: Lin
  fullname: Lin, Gong-Kai
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 7
  givenname: Lin-Fan
  surname: Chen
  fullname: Chen, Lin-Fan
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 8
  givenname: Chun-Chih
  surname: Chen
  fullname: Chen, Chun-Chih
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 9
  givenname: Kuan-I
  surname: Ho
  fullname: Ho, Kuan-I
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 10
  givenname: Che-Hua
  surname: Chang
  fullname: Chang, Che-Hua
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 11
  givenname: Hsiao-Ying
  surname: Yang
  fullname: Yang, Hsiao-Ying
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 12
  givenname: Chung-Ren
  surname: Lao
  fullname: Lao, Chung-Ren
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 13
  givenname: Jian-Hsing
  surname: Lee
  fullname: Lee, Jian-Hsing
  organization: Vanguard International Semiconductor Corporation,Hsinchu,Taiwan
– sequence: 14
  givenname: Ke-Horng
  surname: Chen
  fullname: Chen, Ke-Horng
  organization: National Yang Ming Chiao Tung University,Institute of Electrical and Control Engineering,Hsinchu,Taiwan
BookMark eNo1j11LwzAYhaMoOGf_gRe58q71zVeT3AhSpw4qA63XI01SjfRjrJmj_non6tU5PBweOOfopB96j9AVgYwQ0NfLoliklQl70wsltc4oUJYRoDSXwI9QoqVWTACjnEh-jGZUSJEqqvgZSsbxAwAY0QBEz9DNahNDF75C_4bv_GewHj_5aFr8POziDyzNdGgjricc3z1-Cd2uNTEMPa6Gob1Ap41pR5_85Ry93i-q4jEtVw_L4rZMAyE6plLzxtmaA82dJVop6q0X1PG6UUxTaXNmjdNKNsCM9Y1qaM1yELkTh4mzbI4uf73Be7_ebENnttP6_zL7BjJGT7E
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/ICCE-Taiwan58799.2023.10226704
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEEE Electronic Library (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EISBN 9798350324174
EISSN 2575-8284
EndPage 220
ExternalDocumentID 10226704
Genre orig-research
GroupedDBID 6IE
6IF
6IL
6IN
AAJGR
ABLEC
ADZIZ
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
CHZPO
IEGSK
OCL
RIE
RIL
ID FETCH-LOGICAL-i119t-794fdcb4026dc19882ece52d4bf83927c63cad987f03acef8f2b36056d54bfdc3
IEDL.DBID RIE
IngestDate Wed Jun 26 19:25:26 EDT 2024
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i119t-794fdcb4026dc19882ece52d4bf83927c63cad987f03acef8f2b36056d54bfdc3
PageCount 2
ParticipantIDs ieee_primary_10226704
PublicationCentury 2000
PublicationDate 2023-July-17
PublicationDateYYYYMMDD 2023-07-17
PublicationDate_xml – month: 07
  year: 2023
  text: 2023-July-17
  day: 17
PublicationDecade 2020
PublicationTitle 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)
PublicationTitleAbbrev ICCE-Taiwan
PublicationYear 2023
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0003190019
Score 1.8904026
Snippet Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study,...
SourceID ieee
SourceType Publisher
StartPage 219
SubjectTerms Fingers
Integrated circuits
Layout
Metals
Performance evaluation
Resistance
Simulation
Title Optimizing Device Metal Routing Layouts by the Simulation Tool
URI https://ieeexplore.ieee.org/document/10226704
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3NS8MwFA-6g3hSceI3OYi3dEs_0vbiZW5McVNwg93GyxcUXSvaIdtfb17XTRQEb-HRlIQ0eb-Xvt_vEXKVptKi62PQjn0WAvgMFNcs5hp0CNoqjkThwVD0x-H9JJrUZPWKC2OMqZLPjIfN6l--LtQcr8paGJ2IGNU_t-M0XZG1Nhcq7ltCvLJDrmsdzdZdp9NlI8g-IY8S18HDUuHe-iU_yqlU3qS3R4brcaySSF68eSk9tfwl0fjvge6T5jdxjz5tXNIB2TL5Ibl5dMfCLFs6C701eDLQgXGYm2I2EBofYOFaH1QuqIOD9Dmb1TW96KgoXptk3OuOOn1Wl01gGedpydwOs1pJFxgKrXjqILRRJvJ1KC2ioViJQIFOk9i2A1DGJtaXgYtqhI7cI1oFR6SRF7k5JlQEXFsfQKFkjgNOYNoQisAA923IEzghTZz89G2ljDFdz_v0D_sZ2cU1YJUw5TlplO9zc-Gceikvq8X8Am19odQ
link.rule.ids 310,311,783,787,792,793,799,27937,55086
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LSwMxEA5SQT2pWPFtDuIt22Yf2d2Ll9pSta2CW-itzOYBRbsrukXaX29mu60oCN7CEJaEZDPfJPN9Q8hVHKcGXR-DZugyH8BlILliIVegfFBGciQK9weiO_TvR8GoIquXXBitdZl8ph1slm_5KpczvCprYHQiQlT_3LTAOhJLutb6SsXuJkQsW-S6UtJs3LVabZbA5BOyIApjJKa4nrP6zI-CKqU_6eySwWokyzSSF2dWpI5c_BJp_PdQ90j9m7pHn9ZOaZ9s6OyA3Dzag2E6WVgLvdV4NtC-tqibYj4QGnswt60Pms6pBYT0eTKtqnrRJM9f62TYaSetLqsKJ7AJ53HB7D9mlExtaCiU5LEF0VrqwFV-ahAPhVJ4ElQchabpgdQmMm7q2bhGqMB2UdI7JLUsz_QRocLjyrgAEkVzLHQC3QRfeBq4a3wewTGp4-THb0ttjPFq3id_2C_Jdjfp98a9u8HDKdnB9WClTOUZqRXvM31uXXyRXpQL-wUVVqUf
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2023+International+Conference+on+Consumer+Electronics+-+Taiwan+%28ICCE-Taiwan%29&rft.atitle=Optimizing+Device+Metal+Routing+Layouts+by+the+Simulation+Tool&rft.au=Huang%2C+Shao-Chang&rft.au=Li%2C+Ching-Ho&rft.au=Liao%2C+Chih-Cherng&rft.au=Chuang%2C+Jung-Tsun&rft.date=2023-07-17&rft.pub=IEEE&rft.eissn=2575-8284&rft.spage=219&rft.epage=220&rft_id=info:doi/10.1109%2FICCE-Taiwan58799.2023.10226704&rft.externalDocID=10226704