Unpowered opens test with X-ray laminography
It is shown how X-ray laminography can be used to detect solder opens. With this method X-ray images are taken of the device under test (DUT). The lead content in solder makes the solder joints appear clearly in the image. Using image processing algorithms and also calibration information, the captu...
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Published in | Proceedings - International Test Conference p. 276 |
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Main Author | |
Format | Conference Proceeding Journal Article |
Language | English |
Published |
IEEE
1997
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Subjects | |
Online Access | Get full text |
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Abstract | It is shown how X-ray laminography can be used to detect solder opens. With this method X-ray images are taken of the device under test (DUT). The lead content in solder makes the solder joints appear clearly in the image. Using image processing algorithms and also calibration information, the captured image of the solder joint is automatically translated into key mechanical measurements of the solder joint, such as heel height, center height, toe height, average height, fillet length and width at the toe and the heel. An important feature of this method is that these mechanical characteristics of the solder joint are used by the image processor to automatically determine an open solder joint from a good solder joint. All pins, including VCC and grounds, almost all component types, including bypass capacitors, can be inspected for opens as well as marginal opens. Typically over 98% of all solder joints on a PCB can be inspected. |
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AbstractList | It is shown how X-ray laminography can be used to detect solder opens. With this method X-ray images are taken of the device under test (DUT). The lead content in solder makes the solder joints appear clearly in the image. Using image processing algorithms and also calibration information, the captured image of the solder joint is automatically translated into key mechanical measurements of the solder joint, such as heel height, center height, toe height, average height, fillet length and width at the toe and the heel. An important feature of this method is that these mechanical characteristics of the solder joint are used by the image processor to automatically determine an open solder joint from a good solder joint. All pins, including VCC and grounds, almost all component types, including bypass capacitors, can be inspected for opens as well as marginal opens. Typically over 98% of all solder joints on a PCB can be inspected. The process of using X-ray laminography for detecting solder opens is described. With this method, X-ray images of the device under test (DUT) are taken where solders joints appear clearly. Using image processing algorithm and calibration information, this captured image is automatically translated into key mechanical measurements where the open solder and good solder joints are determined. |
Author | Oresjo, S. |
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Snippet | It is shown how X-ray laminography can be used to detect solder opens. With this method X-ray images are taken of the device under test (DUT). The lead content... The process of using X-ray laminography for detecting solder opens is described. With this method, X-ray images of the device under test (DUT) are taken where... |
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StartPage | 276 |
SubjectTerms | Calibration Image processing Lead Length measurement Mechanical variables measurement Soldering Testing X-ray detection X-ray detectors X-ray imaging |
Title | Unpowered opens test with X-ray laminography |
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