A new ultra-hard etch-stop layer for high precision micromachining

• Published in: Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) pp. 205 - 210
• Main Authors: Borenstein, J.T., Gerrish, N.D., Currie, M.T., Fitzgerald, E.A.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1999
• Subjects: Boron alloys; Doping; Epitaxial layers; Etching; Fabrication; Germanium silicon alloys; Micromachining; Silicon alloys; Silicon germanium; Vibrations

In the present work we describe a high-precision fabrication method for silicon micromachining based on a newly developed epitaxial etch-stop. This etch-stop, composed of a silicon-germanium alloy with no boron doping, outperforms traditional boron-doped etch stops in several important and fundament...