Melt‐Centrifuged (Bi,Sb)2Te3: Engineering Microstructure toward High Thermoelectric Efficiency

• Published in: Advanced materials (Weinheim) Vol. 30; no. 34
• Main Authors: Pan, Yu, Aydemir, Umut, Grovogui, Jann A., Witting, Ian T., Hanus, Riley, Xu, Yaobin, Wu, Jinsong, Wu, Chao‐Feng, Sun, Fu‐Hua, Zhuang, Hua‐Lu, Dong, Jin‐Feng, Li, Jing‐Feng, Dravid, Vinayak P., Snyder, G. Jeffrey
• Format: Journal Article
• Language: English
• Published: Weinheim Wiley Subscription Services, Inc 01.08.2018; Wiley
• Subjects: Antimony; Bismuth; Current carriers; dislocation; Dislocations; Efficiency; Figure of merit; Grain boundaries; Ingots; liquid phase sintering; MATERIALS SCIENCE; melt‐centrifugation; Microstructure; Porosity; Porous materials; p‐type bismuth‐antimony‐telluride; Thermal conductivity; thermoelectric; Thermoelectric materials

Microstructure engineering is an effective strategy to reduce lattice thermal conductivity (κl) and enhance the thermoelectric figure of merit (zT). Through a new process based on melt‐centrifugation to squeeze out excess eutectic liquid, microstructure modulation is realized to manipulate the forma...