Composite coating structure in an implantable electronic device

• Published in: Soldering & surface mount technology Vol. 21; no. 3; pp. 24 - 29
• Main Authors: Kokko, Kati, Harjunpää, Hanna, Heino, Pekka, Kellomäki, Minna
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Group Publishing Limited 26.06.2009; Emerald
• Subjects: Adhesives; Applied sciences; Coatings technology; Design. Technologies. Operation analysis. Testing; Electronics; Environmental protection; Epoxy coatings; Exact sciences and technology; Failure analysis; Flipchips; Humidity; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Integrated circuits; Joining; Joining materials; Medical equipment; Physics; Polymers; Protective coatings; Radiation; Scanning probe microscopes, components and techniques; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Semiconductors; Silicones; Studies; Temperature; Testing, measurement, noise and reliability; Coatings technology; Adhesives; Flipchips; Joining materials; Scanning electron microscopy; Failure analysis; Electronic component; Adhesive joint; Flip-chip; Durability; Reliability; Coatings; Medical application; Composite material; Coated material; Crack

Purpose - The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for conformal coating is considered, especially for medical applications, and medical sterilization is also considered.Design methodology appro...