Composite coating structure in an implantable electronic device
Purpose - The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for conformal coating is considered, especially for medical applications, and medical sterilization is also considered.Design methodology appro...
Saved in:
Published in | Soldering & surface mount technology Vol. 21; no. 3; pp. 24 - 29 |
---|---|
Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Bradford
Emerald Group Publishing Limited
26.06.2009
Emerald |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Purpose - The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for conformal coating is considered, especially for medical applications, and medical sterilization is also considered.Design methodology approach - Two test lots were assembled and one of them was sterilized using gamma sterilization. Both test lots were coated first with epoxy and then with Parylene C, resulting in a composite coating structure. The reliability was studied using a constant humidity test and the failure analysis was performed with cross-sections and scanning electron microscopy analysis. These results were compared to earlier research results on conformal coatings.Findings - The reliability of both test lots proved to be good. The composite coating structure shields the joints from humidity and improves the reliability compared to non-coated test samples. When the conformal coating was compared to the pure Parylene C coated test lot, the reliability was almost the same. This leads to the conclusion that the epoxy layer in the composite coating structure has no value when long-term reliability is considered. Gamma sterilization does not greatly affect reliability. The epoxy coating under the Parylene C layer cracked during reliability testing.Originality value - The paper shows the influence of composite coating structure on the reliability of adhesive flip chip joints, particularly important in medical applications. |
---|---|
AbstractList | Purpose - The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for conformal coating is considered, especially for medical applications, and medical sterilization is also considered. Design-methodology-approach - Two test lots were assembled and one of them was sterilized using gamma sterilization. Both test lots were coated first with epoxy and then with Parylene C, resulting in a composite coating structure. The reliability was studied using a constant humidity test and the failure analysis was performed with cross-sections and scanning electron microscopy analysis. These results were compared to earlier research results on conformal coatings. Findings - The reliability of both test lots proved to be good. The composite coating structure shields the joints from humidity and improves the reliability compared to non-coated test samples. When the conformal coating was compared to the pure Parylene C coated test lot, the reliability was almost the same. This leads to the conclusion that the epoxy layer in the composite coating structure has no value when long-term reliability is considered. Gamma sterilization does not greatly affect reliability. The epoxy coating under the Parylene C layer cracked during reliability testing. Originality-value - The paper shows the influence of composite coating structure on the reliability of adhesive flip chip joints, particularly important in medical applications. Purpose The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for conformal coating is considered, especially for medical applications, and medical sterilization is also considered. Designmethodologyapproach Two test lots were assembled and one of them was sterilized using gamma sterilization. Both test lots were coated first with epoxy and then with Parylene C, resulting in a composite coating structure. The reliability was studied using a constant humidity test and the failure analysis was performed with crosssections and scanning electron microscopy analysis. These results were compared to earlier research results on conformal coatings. Findings The reliability of both test lots proved to be good. The composite coating structure shields the joints from humidity and improves the reliability compared to noncoated test samples. When the conformal coating was compared to the pure Parylene C coated test lot, the reliability was almost the same. This leads to the conclusion that the epoxy layer in the composite coating structure has no value when longterm reliability is considered. Gamma sterilization does not greatly affect reliability. The epoxy coating under the Parylene C layer cracked during reliability testing. Originalityvalue The paper shows the influence of composite coating structure on the reliability of adhesive flip chip joints, particularly important in medical applications. |
Author | Kellomäki, Minna Kokko, Kati Harjunpää, Hanna Heino, Pekka |
Author_xml | – sequence: 1 givenname: Kati surname: Kokko fullname: Kokko, Kati organization: Department of Electronics, Tampere University of Technology, Tampere, Finland – sequence: 2 givenname: Hanna surname: Harjunpää fullname: Harjunpää, Hanna organization: Department of Biomedical Engineering, Tampere University of Technology, Tampere, Finland – sequence: 3 givenname: Pekka surname: Heino fullname: Heino, Pekka organization: Department of Electronics, Tampere University of Technology, Tampere, Finland – sequence: 4 givenname: Minna surname: Kellomäki fullname: Kellomäki, Minna organization: Department of Biomedical Engineering, Tampere University of Technology, Tampere, Finland |
BackLink | http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21654017$$DView record in Pascal Francis |
BookMark | eNqNkU9rFTEUxYNU8PXpB3A3CLpy7E0y-bcSO1QrFOxCcRkymYykziRjMiP67ZvXV97CWlpyIYvzO4fDvcfoKMTgEHqJ4R3GIE9AsQYUvhkBVLInaIMFkzWXlB-hzU6vi4qfoeOcrwCg4Ypu0Ps2TnPMfnGVjWbx4UeVl7TaZU2u8qEyofLTPJqwmG50lRudXVIM3la9--2te46eDmbM7sXtv0XfPp59bc_riy-fPrcfLmrLQS41k9ISIwALKjtrqB2YkNA5zqyl1GEFDcENISDoUHoZzHpjpTEdGZTtO0O36M0-d07x1-ryoiefrRtLMxfXrCmnBAtFHwQJLk9J8hgQFGHyESBupCK4gK_-Aa_imkJZS2E4gQZ4UyC8h2yKOSc36Dn5yaS_GoPenVLfOWXxvL4NNtmacUgmWJ8PxhJeHGW1W1TvOZ8X9-egm_RTc0EF0813oi9bcX7ZnoLedXm7593kkhn7g-NOBT33Q8Hh__j9za8BsQDH6w |
CODEN | SSMOEO |
CitedBy_id | crossref_primary_10_1108_09540911011054181 crossref_primary_10_1016_j_polymer_2011_08_010 crossref_primary_10_2174_1381612827666210825114403 crossref_primary_10_4028_www_scientific_net_KEM_493_494_508 |
Cites_doi | 10.1109/TCAPT.2003.817640 10.1016/j.microrel.2008.10.016 10.1016/j.sna.2004.11.021 10.1109/TBME.1977.326115 10.1109/MMB.2006.251543 10.1108/09540910610717884 10.1109/TNSRE.2003.810431 10.1016/j.snb.2005.11.010 10.1109/HDP.2005.251392 10.1108/09540910910989376 |
ContentType | Journal Article |
Copyright | Emerald Group Publishing Limited 2009 INIST-CNRS Copyright Emerald Group Publishing Limited 2009 |
Copyright_xml | – notice: Emerald Group Publishing Limited – notice: 2009 INIST-CNRS – notice: Copyright Emerald Group Publishing Limited 2009 |
DBID | BSCLL IQODW AAYXX CITATION 7RQ 7SP 7TB 7WY 7XB 8BQ 8FD 8FE 8FG ABJCF AFKRA AZQEC BENPR BEZIV BGLVJ CCPQU D1I DWQXO FR3 GNUQQ HCIFZ JG9 K6~ KB. KR7 L.- L7M M0F M2P PDBOC PQBIZ PQEST PQQKQ PQUKI Q9U 7QO P64 |
DOI | 10.1108/09540910910970385 |
DatabaseName | Istex Pascal-Francis CrossRef ProQuest Career & Technical Education Database Electronics & Communications Abstracts Mechanical & Transportation Engineering Abstracts ABI/INFORM Complete database ProQuest Central (purchase pre-March 2016) METADEX Technology Research Database ProQuest SciTech Collection ProQuest Technology Collection Materials Science & Engineering Collection ProQuest Central ProQuest Central Essentials ProQuest Central ProQuest Business Premium Collection Technology Collection ProQuest One Community College ProQuest Materials Science Collection ProQuest Central Korea Engineering Research Database ProQuest Central Student SciTech Premium Collection Materials Research Database ProQuest Business Collection Materials Science Database Civil Engineering Abstracts ABI/INFORM Professional Advanced Advanced Technologies Database with Aerospace ABI/INFORM Trade & Industry ProQuest Science Journals Materials Science Collection ProQuest One Business ProQuest One Academic Eastern Edition (DO NOT USE) ProQuest One Academic ProQuest One Academic UKI Edition ProQuest Central Basic Biotechnology Research Abstracts Biotechnology and BioEngineering Abstracts |
DatabaseTitle | CrossRef Materials Research Database ProQuest One Business ProQuest Central Student Technology Collection Technology Research Database Mechanical & Transportation Engineering Abstracts ProQuest Central Essentials Materials Science Collection SciTech Premium Collection ProQuest One Community College ABI/INFORM Complete ProQuest Central ABI/INFORM Professional Advanced ProQuest Central Korea Materials Science Database Advanced Technologies Database with Aerospace ProQuest Materials Science Collection Business Premium Collection Civil Engineering Abstracts ProQuest Central Basic ProQuest Science Journals ProQuest One Academic Eastern Edition Electronics & Communications Abstracts ProQuest Technology Collection ProQuest SciTech Collection ProQuest Business Collection METADEX ProQuest Career and Technical Education ProQuest One Academic UKI Edition Materials Science & Engineering Collection ABI/INFORM Trade & Industry Engineering Research Database ProQuest One Academic Biotechnology Research Abstracts Biotechnology and BioEngineering Abstracts |
DatabaseTitleList | Engineering Research Database Engineering Research Database Materials Research Database Materials Research Database Engineering Research Database |
Database_xml | – sequence: 1 dbid: 8FG name: ProQuest Technology Collection url: https://search.proquest.com/technologycollection1 sourceTypes: Aggregation Database |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Applied Sciences Physics |
EISSN | 1758-6836 |
EndPage | 29 |
ExternalDocumentID | 1871975531 10_1108_09540910910970385 21654017 ark_67375_4W2_PC7HPCB0_4 10.1108/09540910910970385 |
Genre | Feature |
GroupedDBID | 0R 123 1WG 3V. 4.4 5VS 70U 7RQ 7WY 8FE 8FG 8FW 8R4 8R5 9E0 AADTA AADXL AAGBP AAMCF AATHL AAUDR ABIJV ABJCF ABSDC ACGFS ACGOD ACIWK ADOMW AEBZA AENEX AEUCW AFKRA AFYHH AFZLO AJEBP ALMA_UNASSIGNED_HOLDINGS ASMFL ASPBG AUCOK AVWKF AZFZN AZQEC BENPR BEZIV BGLVJ BPHCQ BPQFQ BTXLY BUONS CAG COF CS3 D1I DU5 DWQXO EBS ECCUG EJD FNNZZ GEI GEL GNUQQ GQ. GROUPED_ABI_INFORM_COMPLETE H13 HCIFZ HZ IJT IPNFZ J1Y JI- JL0 K6 KB. KBGRL M0F M2P MS O9- P2P PDBOC PQBIZ PQEST PQQKQ PQUKI PRINS PROAC Q2X RIG ROL V1G 0R~ 490 ABKQV ACZLT AODMV BSCLL CCPQU EOXHF HZ~ K6~ M42 MS~ SBBZN AEBVX AFJGD AMLIN BFQZO IQODW UGKUH AAYXX CITATION 7SP 7TB 7XB 8BQ 8FD FR3 JG9 KR7 L.- L7M Q9U 7QO P64 |
ID | FETCH-LOGICAL-c608t-588c2a701738bca3cf5780be65cc33e190421422073f693a15dac8aab2f9cdba3 |
IEDL.DBID | 8FG |
ISSN | 0954-0911 |
IngestDate | Fri Oct 25 23:19:51 EDT 2024 Fri Oct 25 07:18:46 EDT 2024 Fri Oct 25 06:58:18 EDT 2024 Fri Oct 25 05:45:45 EDT 2024 Thu Dec 05 06:58:52 EST 2024 Fri Dec 06 06:20:59 EST 2024 Sun Oct 22 16:07:11 EDT 2023 Wed Oct 30 09:44:32 EDT 2024 Tue Nov 23 15:43:33 EST 2021 Wed Jul 31 14:18:01 EDT 2019 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 3 |
Keywords | Coatings technology Adhesives Flipchips Joining materials Scanning electron microscopy Failure analysis Electronic component Adhesive joint Flip-chip Durability Reliability Coatings Medical application Composite material Coated material Crack |
Language | English |
License | CC BY 4.0 http://www.emeraldinsight.com/page/tdm |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c608t-588c2a701738bca3cf5780be65cc33e190421422073f693a15dac8aab2f9cdba3 |
Notes | original-pdf:2190210304.pdf istex:69FD3C2BCB610F98671BA97263B07AA08FF986E4 ark:/67375/4W2-PC7HPCB0-4 filenameID:2190210304 href:09540910910970385.pdf ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 ObjectType-Article-2 ObjectType-Feature-1 |
PQID | 216204064 |
PQPubID | 23462 |
PageCount | 6 |
ParticipantIDs | proquest_miscellaneous_36321793 proquest_miscellaneous_21209258 proquest_miscellaneous_21212982 emerald_primary_10_1108_09540910910970385 proquest_miscellaneous_21148921 crossref_primary_10_1108_09540910910970385 pascalfrancis_primary_21654017 istex_primary_ark_67375_4W2_PC7HPCB0_4 proquest_journals_216204064 |
PublicationCentury | 2000 |
PublicationDate | 2009-06-26 |
PublicationDateYYYYMMDD | 2009-06-26 |
PublicationDate_xml | – month: 06 year: 2009 text: 2009-06-26 day: 26 |
PublicationDecade | 2000 |
PublicationPlace | Bradford |
PublicationPlace_xml | – name: Bradford |
PublicationTitle | Soldering & surface mount technology |
PublicationYear | 2009 |
Publisher | Emerald Group Publishing Limited Emerald |
Publisher_xml | – sequence: 0 name: Emerald Group Publishing Limited – name: Emerald Group Publishing Limited – name: Emerald |
References | b2 b10 b4 b12 b5 b11 b6 b14 b7 b16 b9 b17 |
References_xml | – ident: b11 doi: 10.1109/TCAPT.2003.817640 – ident: b7 doi: 10.1016/j.microrel.2008.10.016 – ident: b16 – ident: b4 doi: 10.1016/j.sna.2004.11.021 – ident: b10 doi: 10.1109/TBME.1977.326115 – ident: b2 doi: 10.1109/MMB.2006.251543 – ident: b5 doi: 10.1108/09540910610717884 – ident: b12 doi: 10.1109/TNSRE.2003.810431 – ident: b14 doi: 10.1016/j.snb.2005.11.010 – ident: b9 doi: 10.1109/HDP.2005.251392 – ident: b17 – ident: b6 doi: 10.1108/09540910910989376 |
SSID | ssj0004693 |
Score | 1.8294077 |
Snippet | Purpose - The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need... Purpose The purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for... |
SourceID | proquest crossref pascalfrancis istex emerald |
SourceType | Aggregation Database Index Database Publisher Enrichment Source |
StartPage | 24 |
SubjectTerms | Adhesives Applied sciences Coatings technology Design. Technologies. Operation analysis. Testing Electronics Environmental protection Epoxy coatings Exact sciences and technology Failure analysis Flipchips Humidity Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Joining Joining materials Medical equipment Physics Polymers Protective coatings Radiation Scanning probe microscopes, components and techniques Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Silicones Studies Temperature Testing, measurement, noise and reliability |
Title | Composite coating structure in an implantable electronic device |
URI | https://www.emerald.com/insight/content/doi/10.1108/09540910910970385/full/html https://api.istex.fr/ark:/67375/4W2-PC7HPCB0-4/fulltext.pdf https://www.proquest.com/docview/216204064 https://search.proquest.com/docview/21148921 https://search.proquest.com/docview/21209258 https://search.proquest.com/docview/21212982 https://search.proquest.com/docview/36321793 |
Volume | 21 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1La9wwEB7a7KU9hD6pk2arQ1toQdSWZFk6hWTJdik0LKWhuRlZliG08W6yCfTnd8bWOi-64JM9MmZG85Dn8QG8rwqVK-01N0EVHDVRclf7jKNrFKGx2tfdENfvx3p2or6d5qexNmcVyyrXNrEz1PXC0z_yLyKjyenoQPeXF5xAoyi5GhE0HsMoE4Wmij4z_XqrLdJGJHnF0S1mManZAd_gPfKUdBWUHLvjlm56c0fE679UMOlWyLOmB7t4YLc7ZzR9BtsximQHvdifw6PQvoCnt2YLvoR90nSqyArMLxwVN7N-Vuz1ZWBnLXMtOztf_kHGUvMUu4HDYXUg6_EKTqZHPyczHtESuNepueK5MV64AjVMmso76RtUxrQKOvdeyoCOX9F4NYE63SBjXJbXzhvnKtFYX1dOvoatdtGGN8Bk4YTAsDtD8SobjG0cLvapDNaGVLoEPq-ZVS77oRhld5ggRMv7nE3gQ2TnQPuAplzWTQKf7tNteOfHTjADpbv8TRVqRV6qX6KcT4rZfHKYliqB8R3JDQsEdXEhrxLYXYuyjNq7Koe9lsC74SmqHeVSXBsW10SC50grsk0UIrUiNxspMNoy4v8UUktBFnRn41fuwpM-x6W50G9hCzdT2MNQ6aoadwoxhtHh0fH8xz-C1wzD |
link.rule.ids | 314,780,784,12765,21388,27924,27925,33373,33374,33744,33745,43600,43805 |
linkProvider | ProQuest |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT9wwEB61cGh7qPoUgQI-tJVayWpiO45zQnTFdtsC4gAqN8txHAm1zS4sSP35nUm84SVWyikZR9E3noczL4D3VaFypb3mJqiCoyRK7mqfcTSNIjSl9nXXxPXgUE9O1I_T_DTm5sxjWuVCJ3aKup56-kf-RWTUOR0N6M7snNPQKAquxgkaj2FVSbTcVCg-_najLLKMk-QVR7OYxaBmN_gG75GlpKug4Ngts3Rdm7tKWP-jhEk3R8yaftjFPb3dGaPxC3gevUi227P9JTwK7St4dqO34GvYIUmnjKzA_NRRcjPre8VeXQR21jLXsrO_sz8ILBVPsetxOKwOpD3ewMl473g04XFaAvc6NZc8N8YLV6CESVN5J32DwphWQefeSxnQ8CtqryZQphsExmV57bxxrhJN6evKybew0k7bsAZMFk4IdLszZK8qgykbh4t9KkNZhlS6BD4vwLKzvimG7Q4TNNHyLrIJfIhwDrT3aOysbhL4dJduyTs_dowZKN3Fb8pQK3Krfgl7NComR6OvqVUJbN3i3LBAUBUXYpXAxoKVNkrv3A57LYHt4SmKHcVSXBumV0SC58hSZMsoRFqK3CylQG_LiIcppJaCNOj60q_chieT44N9u__98OcGPO3jXZoL_Q5WcGOFTXSbLqutTjj-A7KUDgs |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Composite+coating+structure+in+an+implantable+electronic+device&rft.jtitle=Soldering+%26+surface+mount+technology&rft.au=Kokko%2C+Kati&rft.au=Harjunpaeae%2C+Hanna&rft.au=Heino%2C+Pekka&rft.au=Kellomaeki%2C+Minna&rft.date=2009-06-26&rft.issn=0954-0911&rft.volume=21&rft.issue=3&rft.spage=24&rft.epage=29&rft_id=info:doi/10.1108%2F09540910910970385&rft.externalDBID=NO_FULL_TEXT |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0954-0911&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0954-0911&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0954-0911&client=summon |