Printing Functional 3D Microdevices by Laser‐Induced Forward Transfer

Slender, out‐of‐plane metal microdevices are made in a new spatial domain, by using laser‐induced forward transfer (LIFT) of metals. Here, a thermocouple with a thickness of 10 µm and a height of 250 µm, consisting of platinum and gold pillars is demonstrated. Multimaterial LIFT enables manufacturin...

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Published inSmall (Weinheim an der Bergstrasse, Germany) Vol. 13; no. 9; pp. np - n/a
Main Authors Luo, Jun, Pohl, Ralph, Qi, Lehua, Römer, Gert‐Willem, Sun, Chao, Lohse, Detlef, Visser, Claas Willem
Format Journal Article
LanguageEnglish
Published Germany Wiley Subscription Services, Inc 01.03.2017
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Summary:Slender, out‐of‐plane metal microdevices are made in a new spatial domain, by using laser‐induced forward transfer (LIFT) of metals. Here, a thermocouple with a thickness of 10 µm and a height of 250 µm, consisting of platinum and gold pillars is demonstrated. Multimaterial LIFT enables manufacturing in the micrometer to millimeter range, i.e., between lithography and other 3D printing technologies.
Bibliography:Present address: John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
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ISSN:1613-6810
1613-6829
DOI:10.1002/smll.201602553