Recent development of new inductively coupled thermal plasmas for materials processing

This paper explains recent developments in the field of inductively coupled thermal plasmas (ICTP or ITP) used for materials processing. Inductive coupling technique is important to produce thermal plasma with high gas temperature at high pressures. Conventional cylindrical ICTP was developed origin...

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Published inAdvances in Physics: X Vol. 6; no. 1
Main Author Tanaka, Yasunori
Format Journal Article
LanguageEnglish
Published Abingdon Taylor & Francis 01.01.2021
Informa UK Limited
Taylor & Francis Ltd
Taylor & Francis Group
Subjects
Configurations
Enthalpy
Gas temperature
ICP
Inductive coupling
Inductively coupled plasma
Inductively coupled thermal plasma
Materials processing
nanoparticle synthesis
Physics
Plasma
Plasmas (physics)
pulse modulation
QC1-999
surface modification
Thermal plasmas
Online AccessGet full text
ISSN2374-6149
2374-6149
DOI10.1080/23746149.2020.1867637

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Abstract This paper explains recent developments in the field of inductively coupled thermal plasmas (ICTP or ITP) used for materials processing. Inductive coupling technique is important to produce thermal plasma with high gas temperature at high pressures. Conventional cylindrical ICTP was developed originally in the 1960s by T. Reed. It remains widely used for different materials processing today, with almost identical configuration to the original version. Through some revision and improved functionalization, ICTPs of several kinds such as DC-RF hybrid ICTP have also been developed. They are also widely adopted for processing of various materials because of their various benefits. Inductively coupled plasma at low pressures are not treated herein: only thermal plasma with high enthalpy. One is modulated induction thermal plasma (MITP), which has a function of controlling the temperature and chemical active fields in the time domain. Another development in ICTP includes changes in the ICTP configuration such as a planar-ICTP and loop-ICTP. These were developed for large-area materials processing.
AbstractList This paper explains recent developments in the field of inductively coupled thermal plasmas (ICTP or ITP) used for materials processing. Inductive coupling technique is important to produce thermal plasma with high gas temperature at high pressures. Conventional cylindrical ICTP was developed originally in the 1960s by T. Reed. It remains widely used for different materials processing today, with almost identical configuration to the original version. Through some revision and improved functionalization, ICTPs of several kinds such as DC–RF hybrid ICTP have also been developed. They are also widely adopted for processing of various materials because of their various benefits. Inductively coupled plasma at low pressures are not treated herein: only thermal plasma with high enthalpy. One is modulated induction thermal plasma (MITP), which has a function of controlling the temperature and chemical active fields in the time domain. Another development in ICTP includes changes in the ICTP configuration such as a planar-ICTP and loop-ICTP. These were developed for large-area materials processing.
Author Tanaka, Yasunori
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  fullname: Tanaka, Yasunori
  email: tanaka@ec.t.kanazawa-u.ac.jp
  organization: Institute of Science and Engineering, Kanazawa University
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Snippet This paper explains recent developments in the field of inductively coupled thermal plasmas (ICTP or ITP) used for materials processing. Inductive coupling...
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SubjectTerms Configurations
Enthalpy
Gas temperature
ICP
Inductive coupling
Inductively coupled plasma
Inductively coupled thermal plasma
Materials processing
nanoparticle synthesis
Physics
Plasma
Plasmas (physics)
pulse modulation
QC1-999
surface modification
Thermal plasmas
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Title Recent development of new inductively coupled thermal plasmas for materials processing
URI https://www.tandfonline.com/doi/abs/10.1080/23746149.2020.1867637
https://cir.nii.ac.jp/crid/1873116918037914112
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Volume 6
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