Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

• Published in: Nanomaterials (Basel, Switzerland) Vol. 10; no. 9; p. 1689
• Main Authors: Tomotoshi, Daisuke, Kawasaki, Hideya
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 27.08.2020; MDPI
• Subjects: Carbon; complexes; Conductivity; Copper; Copper oxides; Core-shell structure; Decomposition; Electrical resistivity; Electrodes; Electronics; Flexible components; Gold; Heat conductivity; Heat resistance; Heavy metals; Inks; Insulating layers; Low conductivity; Low temperature; Metals; Nanoparticles; Nanowires; Oxidation; Oxidation resistance; Pastes; Performance enhancement; Polyethylene terephthalate; Polymers; printed electronics; Review; Screen printing; Silver; Sintering; Substrates; Surface activation; Textiles; Thermal conductivity; nanoparticles; printed electronics; flexible devices; copper; pastes; inks; complexes

Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effecti...