Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

• Published in: Microsystems & nanoengineering Vol. 9; no. 1; pp. 156 - 34
• Main Authors: Han, Xiangguang, Huang, Mimi, Wu, Zutang, Gao, Yi, Xia, Yong, Yang, Ping, Fan, Shu, Lu, Xuhao, Yang, Xiaokai, Liang, Lin, Su, Wenbi, Wang, Lu, Cui, Zeyu, Zhao, Yihe, Li, Zhikang, Zhao, Libo, Jiang, Zhuangde
• Format: Journal Article
• Language: English
• Published: London Nature Publishing Group UK 19.12.2023; Springer Nature B.V; Nature Publishing Group
• Subjects: 639/166/987; 639/301/357/995; Accuracy; Avionics; Control methods; Differential pressure; Electronic packaging; Engineering; Microelectromechanical systems; Packaging; Packaging design; Pressure; Pressure sensors; Resonant frequencies; Review; Review Article; Sensors; Trends; Electrical and electronic engineering; Electronic properties and materials

Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based pressure sensors have been widely used for decades, new trends in pressure sensors, including higher sensitivity, higher accuracy, better multifunctiona...