APA (7th ed.) Citation

Tang, Q., Chen, L., Shi, P., & Zhang, Y. (2018). Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation. Advances in Civil Engineering, 2018(2018), 1-9. https://doi.org/10.1155/2018/4891418

Chicago Style (17th ed.) Citation

Tang, Qiang, Lijuan Chen, Peixin Shi, and Yu Zhang. "Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation." Advances in Civil Engineering 2018, no. 2018 (2018): 1-9. https://doi.org/10.1155/2018/4891418.

MLA (9th ed.) Citation

Tang, Qiang, et al. "Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation." Advances in Civil Engineering, vol. 2018, no. 2018, 2018, pp. 1-9, https://doi.org/10.1155/2018/4891418.