Recent progress in silk fibroin-based flexible electronics

• Published in: Microsystems & nanoengineering Vol. 7; no. 1; pp. 35 - 25
• Main Authors: Wen, Dan-Liang, Sun, De-Heng, Huang, Peng, Huang, Wen, Su, Meng, Wang, Ya, Han, Meng-Di, Kim, Beomjoon, Brugger, Juergen, Zhang, Hai-Xia, Zhang, Xiao-Sheng
• Format: Journal Article
• Language: English
• Published: London Nature Publishing Group UK 06.05.2021; Springer Nature B.V; Nature Publishing Group
• Subjects: 639/166/987; 639/925/357/995; Biocompatibility; Biodegradability; Biological materials; Cellulose; Chitosan; Dielectric properties; Dielectric strength; Electronic implants; Electronics; Engineering; Flexible components; Internet of Things; Light penetration; Melanin; Optical properties; Pectin; Piezoelectricity; Review; Review Article; Silk; Silk fibroin; Weight reduction; Electrical and electronic engineering; Electronic properties and materials

With the rapid development of the Internet of Things (IoT) and the emergence of 5G, traditional silicon-based electronics no longer fully meet market demands such as nonplanar application scenarios due to mechanical mismatch. This provides unprecedented opportunities for flexible electronics that by...