Interconnections based on Bi-coated SnAg solder balls
To decrease the bonding temperature required for eutectic SnAg solder, SnAg solder bumps were chemically coated with a pure Bi layer. During heating, a low melting eutectic forms between the Bi coating and the SnAg, enabling bonding at temperatures below the melting points of either pure Bi or SnAg...
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Published in | IEEE transactions on advanced packaging Vol. 24; no. 4; pp. 515 - 520 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Piscataway, NY
IEEE
01.11.2001
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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